Patents by Inventor HOU-EN XIA

HOU-EN XIA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130141885
    Abstract: A housing of an electronic device is provided, which includes a plastic substrate defining a through hole having an inner wall, and an antenna formed on a surface of the plastic substrate. A conductive element is formed on the inner wall of the substrate through hole to electronically connect to the antenna. The conductive element defines a hole. The conductive element hole is filled with solidified poly-putty base.
    Type: Application
    Filed: June 5, 2012
    Publication date: June 6, 2013
    Applicants: FIH (HONG KONG) LIMITED, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
    Inventors: CHANG-HAI GU, JIAN-PING ZHANG, HOU-EN XIA