Patents by Inventor Hou-Ju Li

Hou-Ju Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8125051
    Abstract: A semiconductor device is provided that includes a semiconductor substrate having a first region and a second region, transistors having metal gates formed in the first region, an isolation structure formed in the second region, at least one junction device formed proximate the isolation structure in the second region, and a stopping structure formed overlying the isolation structure in the second region.
    Type: Grant
    Filed: May 22, 2009
    Date of Patent: February 28, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Harry Chuang, Kong-Beng Thei, Chiung-Han Yeh, Mong-Song Liang, Hou-Ju Li, Ming-Yuan Wu, Tzung-Chi Lee
  • Publication number: 20100078728
    Abstract: The present disclosure provides an integrated circuit having metal gate stacks. The integrated circuit includes a semiconductor substrate; a gate stack disposed on the semiconductor substrate, wherein the gate stack includes a high k dielectric layer and a first metal layer disposed on the high k dielectric layer; and a raised source/drain region configured on a side of the gate stack and formed by an epitaxy process, wherein the semiconductor substrate includes a silicon germanium (SiGe) feature underlying the raised source/drain region.
    Type: Application
    Filed: August 24, 2009
    Publication date: April 1, 2010
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hou-Ju Li, Chung Long Cheng, Kong-Beng Thei, Harry Chuang
  • Publication number: 20100001369
    Abstract: A semiconductor device is provided that includes a semiconductor substrate having a first region and a second region, transistors having metal gates formed in the first region, an isolation structure formed in the second region, at least one junction device formed proximate the isolation structure in the second region, and a stopping structure formed overlying the isolation structure in the second region.
    Type: Application
    Filed: May 22, 2009
    Publication date: January 7, 2010
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Harry Chuang, Kong-Beng Thei, Chiung-Han Yeh, Mong-Song Liang, Hou-Ju Li, Ming-Yuan Wu