Patents by Inventor Houg Jun Wang

Houg Jun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder mask configuration for a printed circuit board of a modular jack
    Patent number: 6623306
    Abstract: A printed circuit board (23) used in a modular jack (1) includes a plurality of insertion holes (231, 232) defined through an upper side and a lower side thereof. A conductive layer coating (235) coats an inside of each insertion hole and a conductive base ring (236) forms a rim around each end of each hole. A solder mask (230) covers portions of a front and a rear surfaces of the printed circuit board around the insertion holes. The solder mask covers over the base rings and extends a short distance into each insertion hole, thereby increasing a creepage distance between conductive layer coatings of adjacent holes. This protects the printed circuit board from short circuiting.
    Type: Grant
    Filed: May 8, 2002
    Date of Patent: September 23, 2003
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Zhenghua Xu, Houg Jun Wang, Qisheng Zheng
  • Solder mask configuration for a printed circuit board of a modular jack
    Publication number: 20030119370
    Abstract: A printed circuit board (23) used in a modular jack (1) includes a plurality of insertion holes (231, 232) defined through an upper side and a lower side thereof. A conductive layer coating (235) coats an inside of each insertion hole and a conductive base ring (236) forms a rim around each end of each hole. A solder mask (230) covers portions of a front and a rear surfaces of the printed circuit board around the insertion holes. The solder mask covers over the base rings and extends a short distance into each insertion hole, thereby increasing a creepage distance between conductive layer coatings of adjacent holes. This protects the printed circuit board from short circuiting.
    Type: Application
    Filed: May 8, 2002
    Publication date: June 26, 2003
    Inventors: Zhenghua Xu, Houg Jun Wang, Qisheng Zheng