Patents by Inventor Houjin WANG

Houjin WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device, semiconductor device, packaging structure, bracket and method of manufacturing the bracket
    Patent number: 11881548
    Abstract: An electronic device, a semiconductor device, a packaging structure, a bracket and a method for manufacturing the bracket, belonging to the field of semiconductor device packaging. The bracket includes a first frame and a second frame placed opposite to each other and connected through an electroplating layer. In the above, the first frame and the second frame are both ceramic-based and formed with a metal layer on a surface. The bracket has a longer service life.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: January 23, 2024
    Assignee: SONGSHAN LAKE MATERIALS LABORATORY
    Inventors: Weiyun Wang, Xinqiang Wang, Yongde Li, Houjin Wang, Junjie Kang, Ye Yuan, Wei Luo
  • ELECTRONIC DEVICE, SEMICONDUCTOR DEVICE, PACKAGING STRUCTURE, BRACKET AND METHOD OF MANUFACTURING THE BRACKET
    Publication number: 20220165926
    Abstract: An electronic device, a semiconductor device, a packaging structure, a bracket and a method for manufacturing the bracket, belonging to the field of semiconductor device packaging. The bracket includes a first frame and a second frame placed opposite to each other and connected through an electroplating layer. In the above, the first frame and the second frame are both ceramic-based and formed with a metal layer on a surface. The bracket has a longer service life.
    Type: Application
    Filed: November 24, 2020
    Publication date: May 26, 2022
    Inventors: Weiyun WANG, Xinqiang WANG, Yongde LI, Houjin WANG, Junjie KANG, Ye YUAN, Wei LUO