Patents by Inventor Houko Sutou

Houko Sutou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
    Patent number: 8696942
    Abstract: The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane(meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.
    Type: Grant
    Filed: June 12, 2012
    Date of Patent: April 15, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shigeki Katogi, Hiroyuki Izawa, Houko Sutou, Masami Yusa, Tohru Fujinawa
  • Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
    Patent number: 8518303
    Abstract: The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane(meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.
    Type: Grant
    Filed: March 15, 2006
    Date of Patent: August 27, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shigeki Katogi, Hiroyuki Izawa, Houko Sutou, Masami Yusa, Tohru Fujinawa
  • Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
    Patent number: 8309658
    Abstract: The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: November 13, 2012
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shigeki Katogi, Houko Sutou, Hiroyuki Izawa, Toshiaki Shirasaka, Masami Yusa, Takanobu Kobayashi
  • ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE
    Publication number: 20120273974
    Abstract: The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane (meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.
    Type: Application
    Filed: June 12, 2012
    Publication date: November 1, 2012
    Applicant: HITACHI CHEMICAL CO., LTD.
    Inventors: Shigeki Katogi, Hiroyuki Izawa, Houko Sutou, Masami Yusa, Tohru Fujinawa
  • Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
    Patent number: 8138268
    Abstract: The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.
    Type: Grant
    Filed: June 8, 2005
    Date of Patent: March 20, 2012
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shigeki Katogi, Houko Sutou, Hiroyuki Izawa, Toshiaki Shirasaka, Masami Yusa, Takanobu Kobayashi
  • ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE
    Publication number: 20120063109
    Abstract: The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.
    Type: Application
    Filed: November 17, 2011
    Publication date: March 15, 2012
    Inventors: Shigeki KATOGI, Houko SUTOU, Hiroyuki IZAWA, Toshiaki SHIRASAKA, Masami YUSA, Takanobu KOBAYASHI
  • ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE
    Publication number: 20110176288
    Abstract: The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.
    Type: Application
    Filed: June 8, 2005
    Publication date: July 21, 2011
    Applicant: HITACHI CHEMICAL COMPANY LTD.
    Inventors: Shigeki Katogi, Houko Sutou, Hiroyuki Izawa, Toshiaki Shirasaka, Masami Yusa, Takanobu Kobayashi
  • ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE
    Publication number: 20090309220
    Abstract: The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane (meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.
    Type: Application
    Filed: March 15, 2006
    Publication date: December 17, 2009
    Applicant: HITACHI CHEMICAL CO., LTD.
    Inventors: Shigeki Katogi, Hiroyuki Izawa, Houko Sutou, Masami Yusa, Tohru Fujinawa