Patents by Inventor Houn JOUNG

Houn JOUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10644191
    Abstract: A semiconductor package separating device is provided. The semiconductor package separating device includes a die configured to support a lead frame array including a fixing portion inserted into an insertion groove formed on at least a side surface of a semiconductor package to support the semiconductor package; and a cylindrical punch configured to rotate in a rotational direction, the cylindrical punch including a bending protrusion and a package separating protrusion that are provided on an outer circumferential surface of the cylindrical punch, the bending protrusion being configured to apply pressure to the fixing portion to bend the fixing portion, and the package separating protrusion being configured to apply pressure to the semiconductor package to separate the semiconductor package from the lead frame array in a state in which the fixing portion has been bent by the bending protrusion.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: May 5, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong Ho Lim, Jong Sup Song, Houn Joung
  • Publication number: 20190131488
    Abstract: A semiconductor package separating device is provided. The semiconductor package separating device includes a die configured to support a lead frame array including a fixing portion inserted into an insertion groove formed on at least a side surface of a semiconductor package to support the semiconductor package; and a cylindrical punch configured to rotate in a rotational direction, the cylindrical punch including a bending protrusion and a package separating protrusion that are provided on an outer circumferential surface of the cylindrical punch, the bending protrusion being configured to apply pressure to the fixing portion to bend the fixing portion, and the package separating protrusion being configured to apply pressure to the semiconductor package to separate the semiconductor package from the lead frame array in a state in which the fixing portion has been bent by the bending protrusion.
    Type: Application
    Filed: May 15, 2018
    Publication date: May 2, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong Ho LIM, Jong Sup SONG, Houn JOUNG
  • Publication number: 20040146005
    Abstract: A protection switching apparatus and method uses a node group in a ring ATM system, wherein all connections existing in a node is regarded as one group and a ring node ID is given to each node, thereby including all node IDs of nodes with a subscriber in a GFC (Generic Flow Control) field of an ATM (Asynchronous Transfer Mode) cell that passes through every traffic of the ring, and switching every traffic in a node, the moment protection switching for an arbitrary node group is required.
    Type: Application
    Filed: December 11, 2003
    Publication date: July 29, 2004
    Inventor: Houn-Joung Rim