Patents by Inventor Houssain Jomas

Houssain Jomas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers
    Patent number: 8425785
    Abstract: In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: March 31, 2008
    Date of Patent: April 23, 2013
    Assignee: Intel Corporation
    Inventors: Ravi Nalla, Omar Bchir, Houssain Jomas
  • MECHANICAL ADHESION OF COPPER METALLIZATION TO DIELECTRIC WITH PARTIALLY CURED EPOXY FILLERS
    Publication number: 20090242109
    Abstract: In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: March 31, 2008
    Publication date: October 1, 2009
    Inventors: Ravi Nalla, Omar Behir, Houssain Jomas