Patents by Inventor How Lin
How Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8198739Abstract: A method of forming a compressible contact structure on a semi-conductor chip which comprises bonding a compressible polymer layer to the chip's surface, forming a plurality of openings within the layer, depositing electrically conductive material within the openings to form electrical connections with the chip's contacts, forming a plurality of electrically conductive line elements on the polymer layer extending from a respective opening and each including an end portion, and forming a plurality of contact members each on a respective one of the line segment end portions. The compressible polymer layer allows the contact members to deflect toward (compress) the chip when the contact members are engaged by an external force or forces. A semi-conductor chip including such a compressible contact structure is also provided.Type: GrantFiled: August 13, 2010Date of Patent: June 12, 2012Assignee: Endicott Interconnect Technologies, Inc.Inventors: How Lin, Frank Egitto, Voya Markovich
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Publication number: 20120038046Abstract: A method of forming a compressible contact structure on a semi-conductor chip which comprises bonding a compressible polymer layer to the chip's surface, forming a plurality of openings within the layer, depositing electrically conductive material within the openings to form electrical connections with the chip's contacts, forming a plurality of electrically conductive line elements on the polymer layer extending from a respective opening and each including an end portion, and forming a plurality of contact members each on a respective one of the line segment end portions. The compressible polymer layer allows the contact members to deflect toward (compress) the chip when the contact members are engaged by an external force or forces. A semi-conductor chip including such a compressible contact structure is also provided.Type: ApplicationFiled: August 13, 2010Publication date: February 16, 2012Inventors: How Lin, Frank Egitto, Voya Markovich
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Publication number: 20110144804Abstract: A device for expressing robot autonomous emotions comprises: a sensing unit; a user emotion recognition unit, recognizing current user emotional states after receiving sensed information from the sensing unit, and calculating user emotional strengths based on the current user emotional states; a robot emotion generation unit, generating robot emotional states based on the user emotional strengths; a behavior fusion unit, calculating a plurality of output behavior weights by a fuzzy-neuro network based on the user emotional strengths and a rule table; and a robot reaction unit, expressing a robot emotional behavior based on the output behavior weights and the robot emotional states.Type: ApplicationFiled: May 13, 2010Publication date: June 16, 2011Inventors: Kai-Tai SONG, Meng-Ju Han, Chia-How Lin
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Patent number: 7552091Abstract: A method and system for tracking goods, etc., food products, which involves identifying the received goods at a specified location and thereafter assigning an encoded readable code to each of the goods which can be only accessed by authorized personnel responsible for handling the goods on through to and including shipment, e.g., to customers. A host computer includes a database for encoding received identification data and thereafter encoding same to provide the readable codes. The method and system also allows the customer/recipient to access the codes to discern whether he/she has received the correct goods he purchased.Type: GrantFiled: June 4, 2004Date of Patent: June 23, 2009Assignees: Endicott Interconnect Technologies, Inc., Maines Paper and Food Service, Inc.Inventors: Benson Chan, How Lin, William Maines, Voya Markovich
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Patent number: 7512758Abstract: Provided are a system and method for using a plurality of virtual backup service paths to dynamically switch between storage devices based on a plurality of scenarios. In one example multiple backup service groups are defined. Multiple scenarios that each reference at least one virtual backup service path are also defined. Each virtual backup service path may be defined by at least one network address identifying a storage device. One of the scenarios is selected based on a service level of one or more storage devices, and the virtual backup service path identified by the selected scenario is chosen as a backup destination for at least one of the service groups.Type: GrantFiled: October 5, 2007Date of Patent: March 31, 2009Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tzu-How Lin, Sung-Yen Chang
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Publication number: 20080028259Abstract: Provided are a system and method for using a plurality of virtual backup service paths to dynamically switch between storage devices based on a plurality of scenarios. In one example multiple backup service groups are defined. Multiple scenarios that each reference at least one virtual backup service path are also defined. Each virtual backup service path may be defined by at least one network address identifying a storage device. One of the scenarios is selected based on a service level of one or more storage devices, and the virtual backup service path identified by the selected scenario is chosen as a backup destination for at least one of the service groups.Type: ApplicationFiled: October 5, 2007Publication date: January 31, 2008Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTDInventors: Tzu-How Lin, Sung-Yen Chang
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Publication number: 20080020566Abstract: A method of making an interposer in which at least two dielectric layers are bonded to each other to sandwich a plurality of conductors there-between. The conductors each electrically couple a respective pair of opposed electrical contacts which are formed within and protrude from openings which are also formed within the dielectric layers as part of this method. The resulting interposer is ideally suited for use as part of a test apparatus to interconnect highly dense patterns of solder ball contacts of a semiconductor chip to lesser dense arrays of contacts on the apparatus's printed circuit board.Type: ApplicationFiled: September 27, 2007Publication date: January 24, 2008Applicant: Endicott Interconnect Technologies, Inc.Inventors: Frank Egitto, How Lin
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Patent number: 7299326Abstract: Provided are a system and method for using a plurality of virtual backup service paths to dynamically switch between storage devices based on a plurality of scenarios. In one example multiple backup service groups are defined. Multiple scenarios that each reference at least one virtual backup service path are also defined. Each virtual backup service path may be defined by at least one network address identifying a storage device. One of the scenarios is selected based on a service level of one or more storage devices, and the virtual backup service path identified by the selected scenario is chosen as a backup destination for at least one of the service groups.Type: GrantFiled: June 9, 2004Date of Patent: November 20, 2007Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tzu-How Lin, Sung-Yen Chang
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Publication number: 20070249089Abstract: A method of making circuitized substrate comprised of at least one dielectric material having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device.Type: ApplicationFiled: June 12, 2007Publication date: October 25, 2007Applicant: Endicott Interconnect Technologies, Inc.Inventors: Subahu Desai, How Lin, John Lauffer, Voya Markovich, David Thomas
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Publication number: 20070150724Abstract: A data archiving and accessing system. The system comprises a client and a server. The client uploads transaction data and a public key. The server further comprises a database storing the transaction data and a transaction system.Type: ApplicationFiled: December 27, 2005Publication date: June 28, 2007Inventor: Tzu-How Lin
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Publication number: 20070139977Abstract: A method of improving conductive paste connections in a circuitized substrate in which at least one and preferably a series of high voltage pulses are applied across the paste and at least one and preferably a series of high current pulses are applied, both series of pulses applied separately. The result is an increase in the number of conductive paths through the paste connections from those present prior to the pulse applications and a corresponding resistance reduction in said connections.Type: ApplicationFiled: December 19, 2005Publication date: June 21, 2007Applicant: Endicott Interconnect Technologies, Inc.Inventors: Subahu Desai, John Lauffer, How Lin, Voya Markovich, Ronald Smith
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Publication number: 20070031084Abstract: A system for monitoring traffic across a structure. A fiber Bragg grating (FBG) reflects a light wavelength. A mounting mechanism connects the FBG to the structure, such that physical change of the structure changes a stress to the FBG that changes the light wavelength. And optical fiber carries a first light beam to the FBG and carries a second light beam from the FGB. This permits first light beam including the light wavelength to be received from a light source, and permits the first light beam to be altered into the second light beam by passing the light wavelength through the FBG, and permits the second light beam to be provided to a detector to sense the light wavelength present in the second light beam. From this the stress in the structure and information about the traffic across a structure can be inferred.Type: ApplicationFiled: June 20, 2006Publication date: February 8, 2007Applicant: Fibera, Inc.Inventors: David Wang, John Tsai, How Lin, Le-Heng Wang
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Publication number: 20070010065Abstract: A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.Type: ApplicationFiled: February 13, 2006Publication date: January 11, 2007Applicant: Endicott Interconnect Technologies, Inc.Inventors: Rabindra Das, John Lauffer, How Lin, Voya Markovich
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Publication number: 20070010064Abstract: A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. Photoimageable material is used to facilitate positioning of the capacitive dielectric being printed. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.Type: ApplicationFiled: February 13, 2006Publication date: January 11, 2007Applicant: Endicott Interconnect Technologies, Inc.Inventors: Rabindra Das, John Lauffer, How Lin, Voya Markovich
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Patent number: 7142121Abstract: A radio frequency (RF) device (or “tag”) for containing specific information relating to a particular good being shipped from one location (e.g., warehouse) to another (e.g., customer). The device includes a circuitized substrate (e.g., a printed circuit board), a semiconductor chip, an antenna and a power regulator, and is designed in one embodiment to be partly inserted within a good (e.g., a cardboard box) containing one or more of the goods being shipped and tracked. Alternatively, the device may be attached by other means (e.g., adhesive). A shipper can simply track the goods containing such devices using wireless communication devices (e.g., satellites) to quickly and readily ascertain the specific location of the goods at any time as well as the appropriate desired information relating to such goods (e.g., quantity, weight, type, etc.).Type: GrantFiled: June 4, 2004Date of Patent: November 28, 2006Assignee: Endicott Interconnect Technologies, Inc.Inventors: Benson Chan, William Kimler, How Lin, William Maines, Voya Markovich
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Publication number: 20060238207Abstract: An interposer comprising at least two dielectric layers bonded to each other, sandwiching a plurality of conductors there-between. The conductors each electrically couple a respective pair of opposed electrical contacts formed within and protruding from openings with the dielectric layers. The interposer is ideally suited for use as part of a test apparatus to interconnect highly dense patterns of solder ball contacts of a semiconductor chip to lesser dense arrays of contacts on the apparatus's printed circuit board. The interposer is also capable of being used for other purposes, including as an interconnecting circuitized substrate between a semiconductor chip and a chip carrier substrate or between a chip carrier and a printed circuit board. Various methods of making such an interposer are also provided.Type: ApplicationFiled: April 21, 2005Publication date: October 26, 2006Applicant: Endicott Interconnect Technologies, Inc.Inventors: Frank Egitto, How Lin
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Publication number: 20060213973Abstract: An electronic card assembly is provided which includes a protective housing having a movable card therein. The card, in one example one having a magnetic stripe, has its information erased when being inserted into the housing and re-written back onto its information portion (magnetic stripe) during card withdrawal, provided appropriate human information (e.g., from a fingerprint) is received by the assembly's reader component.Type: ApplicationFiled: March 23, 2005Publication date: September 28, 2006Applicant: Endicott Interconnect Technologies, Inc.Inventors: Benson Chan, How Lin, Voya Markovich, Ronald Smith
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Publication number: 20060182397Abstract: An optoelectronic assembly for an electronic system includes a thermally conductive, metallized transparent substrate having a first surface and an opposite second surface. A support chip set is bonded to the second surface of the transparent substrate. A first substrate is in communication with the transparent substrate via the metallized second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support chip set, and an optical signaling medium having one end with an optical fiber array aligned with the transducer is substantially normal to the first surface of the transparent substrate. The support chip set and the transducer share a common thermal path for cooling.Type: ApplicationFiled: April 11, 2006Publication date: August 17, 2006Applicant: International Business Machines CorporationInventors: Alan Benner, How Lin, Frank Pompeo, Subhash Shinde
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Publication number: 20060022310Abstract: An electrical assembly which includes a circuitized substrate comprised of an organic dielectric material having a first electrically conductive pattern thereon. At least part of the dielectric layer and pattern form the first, base portion of an organic memory device, the remaining portion being a second, polymer layer formed over the part of the pattern and a second conductive circuit formed on the polymer layer. A second dielectric layer if formed over the second conductive circuit and first circuit pattern to enclose the organic memory device. The device is electrically coupled to a first electrical component through the second dielectric layer and this first electrical component is electrically coupled to a second electrical component. A method of making the electrical assembly is also provided, as is an information handling system adapted for using one or more such electrical assemblies as part thereof.Type: ApplicationFiled: July 28, 2004Publication date: February 2, 2006Applicant: Endicott Interconnect Technologies, Inc.Inventors: Frank Egitto, John Lauffer, How Lin, Voya Markovich, David Thomas
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Publication number: 20060022303Abstract: A circuitized substrate comprised of at least one dielectric material having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device. The substrate is preferably combined with other dielectric-circuit layered assemblies to form a multilayered substrate on which can be positioned discrete electronic components (e.g., a logic chip) coupled to the internal memory device to work in combination therewith. An electrical assembly capable of using the substrate is also provided, as is an information handling system adapted for using one or more such electrical assemblies as part thereof.Type: ApplicationFiled: July 28, 2004Publication date: February 2, 2006Applicant: Endicott Interconnect Technologies, Inc.Inventors: Subahu Desai, How Lin, John Lauffer, Voya Markovich, David Thomas