Abstract: An optoelectronic assembly for an electronic system includes a thermally conductive, metallized transparent substrate having a first surface and an opposite second surface. A support chip set is bonded to the transparent substrate. A first substrate is in communication with the transparent substrate via the second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support chip set, and an optical signaling medium having one end with an optical fiber array aligned with the transducer is substantially normal to the first surface of the transparent substrate. The support chip set and the transducer share a common thermal path for cooling.

Abstract: An optoelectronic assembly for a computer system includes an electronic chip(s), a substrate, an electrical signaling medium, an optoelectronic transducer, and an optical coupling guide. The electronic chip(s) is in communication with the substrate, which is in communication with a first end of the electrical signaling medium. A second end of the electrical signaling medium is in communication with the optoelectronic transducer, and includes the optical coupling guide for aligning an optical signaling medium with the optoelectronic transducer. An electrical signal from the electronic chip is communicated to the optoelectronic transducer via the substrate and the electrical signaling medium. The optical transducer and electronic chip(s) share a common heat spreader, and communication to other groups of electronic chip(s) is done without the need for communication via a second level electrical package.

Abstract: An optoelectronic assembly for an electronic system includes a transparent substrate having a first surface and an opposite second surface, the transparent substrate being thermally conductive and being metallized on the surface. A support electronic chip set is configured for at least one of providing multiplexing, demultiplexing, coding, decoding and optoelectronic transducer driving and receive functions and is bonded to the second surface of the transparent substrate. A first substrate having a first surface and an opposite second surface, is in communication with the transparent substrate via the metallized second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips.

Abstract: A method and apparatus are disclosed for aligning an array of light transmitting elements to an array of photosensitive detectors. The array is adjusted along three axes. Any element (a coupled transmitting and detecting unit of the array) can be selected as the center of rotation. Small angular correction is made about the selected element by differentially moving the array in two axes, using adjustment tools. Alignment is accomplished by performing translational movement in the horizontal X and Y axes until a signal is detected. A rotational correction about the selected element is performed by moving one of a pair of adjustment devices until maximum light intensity is achieved for the end elements. Next, the array is scanned for the weakest performing element in the array. The alignment procedure is repeated until the performance of all of the elements in the array fall within a pre-established specification range.

Abstract: Optical packages and a method of fabricating same, wherein an active optical device can be located relative to a substrate and coupler. The structure includes a substrate having electrical contact pads and alignment pads with precision aligned through-holes for at least one optical fiber. The optical fibers are supported by a housing, or coupler, having alignment pins that are precision located relative to the through-holes in the substrate and the optical fiber. A die, or active optical device, with one or more active optical elements on a first die surface and electrical contacts on a second die surface, is aligned with the electrical pads of the substrate and the active optical elements. The method incorporates the steps of grinding alignment pins into metallic pads and grinding optical fibers in one pass and then aligning the active optical device and the optical fibers by using the surface tension of conductive adhesive liquid. The fibers are then bonded.

Abstract: A multi-layer electronic structure includes an increased capacity for the attachment of active or passive devices thereto. This is achieved by creating a three-dimensional grid of connection points to electrically couple active or passive surface mounted devices to edge mounted devices. The grid pattern is useful with any laminate including circuit cards, ceramic modules and flexible circuits. The variety of electrical devices that may be connected to the cross-sectional substrate includes, but is not limited to, chips such as semiconductor chips, diodes, resistors, capacitors and printed wiring boards. The structure can be used to more rapidly pass data, such as optical data that is transmitted from a spectroscope through a VCSEL laser and the electronic structure to a computer for diagnostics and analysis. A stepped arrangement of circuitized laminates is described for this purpose.

Abstract: A package is described that couples a twelve channel wide fiber optic cable to a twelve channel Vertical Cavity Surface Emitting Laser (VCSEL) transmitter and a multiple channel Perpendicularly Aligned Integrated Die (PAID) receiver. The package allows for reduction in the height of the assembly package by vertically orienting certain dies parallel to the fiber optic cable and horizontally orienting certain other dies. The assembly allows the vertically oriented optoelectronic dies to be perpendicularly attached to the horizontally oriented laminate via a flexible circuit.

Abstract: An optical detection and measurement system for selectively detecting the plane of the reflective surfaces of a workpiece. A laser source provides a low power, single wavelength collimated beam of light which is directed onto a workpiece. The beam is passed through a converging lens to a reflected focus on a quad detector. The light beams reflected from the workpiece pass through a diverging lens to the quad detector. The non-diverging optical axis center of the diverging lens is aligned with the center of the quad detector so that a reflected beam passing through the non-diverging optical axis center of the diverging lens creates equal photocurrent outputs from each of the four photosensitive elements of the quad detector to produce a null condition. Where the workpiece is made up of translucent or transparent layers which produce multiple reflected beams, reflected beams from surfaces other than the surface of interest are deflected away from the active surface of the quad detector by the diverging lens.

Abstract: Apparatus and method for compensating for distortion of the substrate of a printed circuit workpiece that involves performing two tasks. First, a mask that carries functional circuit features and alignment features is positioned rotatably so that the mask alignment features, when projected onto a table that holds the printed circuit workpiece, will be on a line extending parallel to one of two orthogonal axes of the table. Second, the spacing of alignment features on the printed circuit workpiece is determined and this determination is a measure of the distortion of the printed circuit workpiece substrate. A lens through which the mask image is projected is moved to adjust the magnification of the image in accordance with the measured distortion of the substrate of the printed circuit workpiece.

Abstract: A photolithography imaging system and method that performs the tasks of mask alignment, panel recognition, establishing position offsets and adjusting mask rotation for accurate overlay imaging of the mask onto the panel, and correctly adjusting image magnification or reduction to properly size each stepped image to the panel distortion. This invention applies more directly to substrate panels whose dimensional stability is found difficult to control, repeatedly. More specifically, it applies to panels whose X axis distortion factor varies greatly from its Y axis distortion factor and the average adjustment of the image magnification or reduction does not satisfy tight registration requirements. What is new is that the calculation of the magnification or reduction adjustment is based on the mask image dimensions.

Abstract: A method and apparatus are disclosed for aligning an array of light transmitting elements to an array of photosensitive detectors. The array is adjusted along three axes. Any element (a coupled transmitting and detecting unit of the array) can be selected as the center of rotation. Small angular correction is made about the selected element by differentially moving the array in two axes, using adjustment tools. Alignment is accomplished by performing translational movement in the horizontal X and Y axes until a signal is detected. A rotational correction about the selected element is performed by moving one of a pair of adjustment devices until maximum light intensity is achieved for the end elements. Next, the array is scanned for the weakest performing element in the array. The alignment procedure is repeated until the performance of all of the elements in the array fall within a pre-established specification range.

Abstract: A method and apparatus are disclosed for aligning an array of light transmitting elements to an array of photosensitive detectors. The array is adjusted along three axes. Any element (a coupled transmitting and detecting unit of the array) can be selected as the center of rotation. Small angular correction is made about the selected element by differentially moving the array in two axes, using adjustment tools. Alignment is accomplished by performing translational movement in the horizontal X and Y axes until a signal is detected. A rotational correction about the selected element is performed by moving one of a pair of adjustment devices until maximum light intensity is achieved for the end elements. Next, the array is scanned for the weakest performing element in the array. The alignment procedure is repeated until the performance of all of the elements in the array fall within a pre-established specification range.

Abstract: An optical coupling assembly is described that optically aligns an opto-electronic device, such as a Vertical Cavity Surface Emitting Laser (VCSEL) chip, with a fiber optic coupler upon a heatsink substrate. The assembly has a number of biasing elements that acts against the coupler to provide contact with mating surfaces. Adjustment devices, such as screws, acting against the coupler and biasing elements, are adjusted until the fiber optic transmitting elements of the coupler align with the opto-electronic device light emitting elements. Photodetectors disposed upon a distal end of the coupler receive the light from the opto-electronic device, and provide a mechanism to detect optimum alignment.

Abstract: A multi-layer electronic structure includes an increased capacity for the attachment of active or passive devices thereto. This is achieved by creating a three-dimensional grid of connection points to electrically couple active or passive surface mounted devices to edge mounted devices. The grid pattern is useful with any laminate including circuit cards, ceramic modules and flexible circuits. The variety of electrical devices that may be connected to the cross-sectional substrate includes, but is not limited to, chips such as semiconductor chips, diodes, resistors, capacitors and printed wiring boards. The structure can be used to more rapidly pass data, such as optical data that is transmitted from a spectroscope through a VCSEL laser and the electronic structure to a computer for diagnostics and analysis. A stepped arrangement of circuitized laminates is described for this purpose.

Abstract: An optical detection and measurement system for selectively detecting the plane of the reflective surfaces of a workpiece. A laser source provides a low power, single wavelength collimated beam of light which is directed onto a workpiece. The beam is passed through a converging lens to a reflected focus on a quad detector. The light beams reflected from the workpiece pass through a diverging lens to the quad detector. The non-diverging optical axis center of the diverging lens is aligned with the center of the quad detector so that a reflected beam passing through the non-diverging optical axis center of the diverging lens creates equal photocurrent outputs from each of the four photosensitive elements of the quad detector to produce a null condition. Where the workpiece is made up of translucent or transparent layers which produce multiple reflected beams, reflected beams from surfaces other than the surface of interest are deflected away from the active surface of the quad detector by the diverging lens.

Abstract: Apparatus and method for compensating for distortion of the substrate of a printed circuit workpiece that involves performing two tasks. First, a mask that carries functional circuit features and alignment features is positioned rotatably so that the mask alignment features, when projected onto a table that holds the printed circuit workpiece, will be on a line extending parallel to one of two orthogonal axes of the table. Second, the spacing of alignment features on the printed circuit workpiece is determined and this determination is a measure of the distortion of the printed circuit workpiece substrate. A lens through which the mask image is projected is moved to adjust the magnification of the image in accordance with the measured distortion of the substrate of the printed circuit workpiece.

Abstract: An assembly is described that consists of a gallium arsenide die chip and a fiber optic coupler bonded together about their respective mating surfaces. The chip includes laser light emitters. The fiber optic coupler has fiber optic light transmitters that require precise alignment with the laser light emitters of the chip about their mating surfaces. After alignment of the emitting/receiving and transmitting elements, the mating surfaces of the chip and coupler are bonded together.