Patents by Inventor How-Wen CHIEN

How-Wen CHIEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FUNCTIONAL FINGERTIP SLEEVE
    Publication number: 20150084880
    Abstract: A fingertip sleeve used for touching a screen includes a sleeve, a canner, a microprocessor and a speaker. The touch region can be configured to touch the screen. The scanner can be configured to scan information displayed on the screen and convert the displayed information into digital signals. The microprocessor can be electronically connected to the scanner and converting the digital signals into audio signals. The speaker can be electronically connected to the microprocessor and outputting audio based on the audio signals.
    Type: Application
    Filed: January 24, 2014
    Publication date: March 26, 2015
    Applicant: CHIUN MAI COMMUNICATION SYSTEMS, INC.
    Inventors: HOW-WEN CHIEN, CHE-HSIN CHAO, BO-HAN CHU, KUI-HAO CHANG
  • Bond type flip-chip light-emitting structure and method of manufacturing the same
    Patent number: 8686395
    Abstract: A bond type flip-chip light-emitting structure and method of manufacturing the same. Firstly, form a positive electrode and a negative electrode on an epitaxy layer. Next, deposit an insulation layer on parts of the positive electrode and negative electrode, to expose respectively a positive electrode via hole and a negative electrode via hole. Then, form a bonded metal layer on the insulation layer, the positive electrode via hole, and the negative electrode via hole, so that the positive electrode and the negative electrode are on a same plane by means of the bonded metal layer. Finally, on a substrate, bond the first metal layer and the second metal layer onto the corresponding first bonded metal unit and the second bonded metal unit of the bonded metal layer, to form into shape, thus realizing a bond type flip-chip light-emitting structure.
    Type: Grant
    Filed: February 25, 2013
    Date of Patent: April 1, 2014
    Assignee: Chang Gung University
    Inventors: Liann-Be Chang, Chen Xu, Kun Xu, Yunyun Zhang, How-Wen Chien
  • Bond type flip-chip light-emitting structure and method of manufacturing the same
    Publication number: 20130234105
    Abstract: A bond type flip-chip light-emitting structure and method of manufacturing the same. Firstly, form a positive electrode and a negative electrode on an epitaxy layer. Next, deposit an insulation layer on parts of the positive electrode and negative electrode, to expose respectively a positive electrode via hole and a negative electrode via hole. Then, form a bonded metal layer on the insulation layer, the positive electrode via hole, and the negative electrode via hole, so that the positive electrode and the negative electrode are on a same plane by means of the bonded metal layer. Finally, on a substrate, bond the first metal layer and the second metal layer onto the corresponding first bonded metal unit and the second bonded metal unit of the bonded metal layer, to form into shape, thus realizing a bond type flip-chip light-emitting structure.
    Type: Application
    Filed: February 25, 2013
    Publication date: September 12, 2013
    Applicant: CHANG GUNG UNIVERSITY
    Inventors: Liann-Be CHANG, Chen XU, Kun XU, Yunyun ZHANG, How-Wen CHIEN