Patents by Inventor How Yang LIM

How Yang LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Image sensor package with transparent adhesive covering the optical sensing circuit
    Patent number: 11798967
    Abstract: An integrated circuit package includes a support substrate having a front side and a back side and an optical integrated circuit die having a back side mounted to the front side of the support substrate and having a front side with an optical sensing circuit. A glass optical element die has a back side mounted to the front side of the optical integrated circuit die over the optical sensing circuit. The mounting of the glass optical element die is made by a layer of transparent adhesive which extends to the cover the optical sensing circuit and a portion of the front side of the optical integrated circuit die peripherally surrounding the optical sensing circuit. An encapsulation material body encapsulates the glass optical element die and the optical integrated circuit die.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: October 24, 2023
    Assignees: STMicroelectronics Asia Pacific Pte Ltd, STMicroelectronics (Grenoble 2) SAS
    Inventors: How Yang Lim, Olivier Zanellato
  • IMAGE SENSOR PACKAGE
    Publication number: 20230104584
    Abstract: An integrated circuit package includes a support substrate having a front side and a back side and an optical integrated circuit die having a back side mounted to the front side of the support substrate and having a front side with an optical sensing circuit. A glass optical element die has a back side mounted to the front side of the optical integrated circuit die over the optical sensing circuit. The mounting of the glass optical element die is made by a layer of transparent adhesive which extends to the cover the optical sensing circuit and a portion of the front side of the optical integrated circuit die peripherally surrounding the optical sensing circuit. An encapsulation material body encapsulates the glass optical element die and the optical integrated circuit die.
    Type: Application
    Filed: October 6, 2021
    Publication date: April 6, 2023
    Applicants: STMicroelectronics Asia Pacific Pte Ltd, STMicroelectronics (Grenoble 2) SAS
    Inventors: How Yang LIM, Olivier ZANELLATO