Patents by Inventor Howard A. Wilson
Howard A. Wilson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10278889Abstract: A modular self-massaging apparatus includes a framework and a ball assembly mounted to the framework. The ball assembly is modular and can be disassembled and reassembled in a variety of configurations. The apparatus is modular because the ball assembly and other ball assemblies can be applied to and carried in the apparatus at a variety of locations across the apparatus.Type: GrantFiled: February 16, 2016Date of Patent: May 7, 2019Inventors: Craig A. Olschansky, William R. Hanson, Donald Hollenbeck, Howard A. Wilson, IV
-
Publication number: 20170231862Abstract: A modular self-massaging apparatus includes a framework and a ball assembly mounted to the framework. The ball assembly is modular and can be disassembled and reassembled in a variety of configurations. The apparatus is modular because the ball assembly and other ball assemblies can be applied to and carried in the apparatus at a variety of locations across the apparatus.Type: ApplicationFiled: February 16, 2016Publication date: August 17, 2017Inventors: Craig A. Olschansky, William R. Hanson, Donald Hollenbeck, Howard A. Wilson, IV
-
Publication number: 20160170456Abstract: An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout.Type: ApplicationFiled: September 25, 2012Publication date: June 16, 2016Applicant: INTEL CORPORATIONInventors: Siva G. Narendra, James W. Tschanz, Howard A. Wilson, Donald S. Gardner, Peter Hazucha, Gerhard Schrom, Tanay Karnik, Nitin Borkar, Vivek K. De, Shekhar Y. Borkar
-
Publication number: 20140089687Abstract: An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout.Type: ApplicationFiled: September 25, 2012Publication date: March 27, 2014Inventors: Siva G. Narendra, James W. Tschanz, Howard A. Wilson, Donald S. Gardner, Peter Hazucha, Gerhard Schrom, Tanay Karnik, Nitin Borkar, Vivek K. De, Shekhar Y. Borkar
-
Patent number: 8288846Abstract: An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout.Type: GrantFiled: February 24, 2010Date of Patent: October 16, 2012Assignee: Intel CorporationInventors: Siva G. Narendra, James W. Tschanz, Howard A. Wilson, Donald S. Gardner, Peter Hazucha, Gerhard Schrom, Tanay Karnik, Nitin Borkar, Vivek K. De, Shekhar Y. Borkar
-
Publication number: 20100219516Abstract: An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout.Type: ApplicationFiled: February 24, 2010Publication date: September 2, 2010Inventors: Siva G. Narendra, James W. Tschanz, Howard A. Wilson, Donald S. Gardner, Peter Hazucha, Gerhard Schrom, Tanay Karnik, Nitin Borkar, Vivek K. De, Shekhar Y. Borkar
-
Patent number: 7782887Abstract: An apparatus for driver power and size selection includes in one embodiment a controller for controlling the enabling and disabling of legs in a legged driver, the legged driver providing only that amount of power necessary to transfer a data packet from its current location to its destination location. A method of forwarding data packets includes determining the distance between a current location of a data packet and the destination location of the data packet, and enabling as many legs of a legged driver as are necessary to power the transfer of the data packet to its destination.Type: GrantFiled: February 8, 2005Date of Patent: August 24, 2010Assignee: Intel CorporationInventors: Sriram R. Vangal, Howard A. Wilson
-
Publication number: 20100115301Abstract: A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a voltage regulator die bonded to the CPU die in a three dimensional packaging layout.Type: ApplicationFiled: January 8, 2010Publication date: May 6, 2010Inventors: Siva G. Narendra, Howard A. Wilson, Donald S. Gardner, Peter Hazucha, Gerhard Schrom, Tanay Karnik, Nitin Borkar, Vivek K. De, Shekhar Y. Borkar
-
Patent number: 7698576Abstract: A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a voltage regulator die bonded to the CPU die in a three dimensional packaging layout.Type: GrantFiled: September 30, 2004Date of Patent: April 13, 2010Assignee: Intel CorporationInventors: Siva G. Narendra, Howard A. Wilson, Donald S. Gardner, Peter Hazucha, Gerhard Schrom, Tanay Karnik, Nitin Borkar, Vivek K. De, Shekhar Y. Borkar
-
Patent number: 7671456Abstract: An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout.Type: GrantFiled: July 3, 2007Date of Patent: March 2, 2010Assignee: Intel CorporationInventors: Siva G. Narendra, James W. Tschantz, Howard A. Wilson, Donald S. Gardner, Peter Hazucha, Gerhard Schrom, Tanay Karnik, Nitin Borkar, Vivek K. De, Shekhar Y. Borkar
-
Patent number: 7247930Abstract: A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a power management die bonded to the CPU die in a three dimensional packaging layout.Type: GrantFiled: September 30, 2004Date of Patent: July 24, 2007Assignee: Intel CorporationInventors: Siva G. Narendra, James W. Tschantz, Howard A. Wilson, Donald S. Gardner, Peter Hazucha, Gerhard Schrom, Tanay Karnik, Nitin Borkar, Vivek K. De, Shekhar Y. Borkar
-
Patent number: 6853644Abstract: An apparatus for driver power and size selection includes in one embodiment a controller for controlling the enabling and disabling of legs in a legged driver, the legged driver providing only that amount of power necessary to transfer a data packet from its current location to its destination location. A method of forwarding data packets includes determining the distance between a current location of a data packet and the destination location of the data packet, and enabling as many legs of a legged driver as are necessary to power the transfer of the data packet to its destination.Type: GrantFiled: December 22, 1999Date of Patent: February 8, 2005Assignee: Intel CorporationInventors: Sriram R. Vangal, Howard A. Wilson
-
Patent number: 4989170Abstract: The present invention provides a technique for updating the coefficients a(n) of an adaptive filter impulse response A(n), whereA'(n)=(a.sub.o (n) a.sub.l (n) . . . a.sub.m (n))is the adaptive filter impulse response at time n. The impulse response is utilized for tracking the output y(n) of a communications channel, where ##EQU1## where H is an unknown impulse response of the channel,H'=(h.sub.o h.sub.l . . . h.sub.m),the ' character denoting transposition. The channel is driven with a known input signal s(n), whereS'(n)=(s(n) s(n-l) . . . s(n-m)).According to the techinque, the output x(n) of an adaptive filter, wherex(n)=S'(n)A(n)is compared with the channel output y(n) according to the Least Mean Squares (LMS) algorithm to develop an LMS error prediction signal. At the same time, the adaptive filter output x(n) is compared with the channel output y(n) according to the Sign Algorithm (SA) to develop an SA error prediction signal.Type: GrantFiled: February 8, 1990Date of Patent: January 29, 1991Assignee: National Semiconductor CorporationInventors: Roy G. Batruni, Howard A. Wilson
-
Patent number: 4926472Abstract: The present invention provides a technique for data detection signal processing for removing echo interference and/or distortion from a received 2B1Q coded signal. According to the preferred technique, the received 2B1Q signal Q, where q=(-3, -1, +1, +3), is shifted one bit to the left to generate a corresponding shifted symbol alphabet S, where S=(-2, 0, +2, +4). The shifted received signals are then processed through a transversal filter. That is, the signal is provided to a delay line which is tapped at intervals corresponding to the symbol width of the received signal. Each tap along the delay line is connected through an amplifier to a summing device that provides an output y(n), where ##EQU1## The tap gains, or coefficients a.sub.j, are set to subtract the effects of interference from symbols that are adjacent in time to the desired symbol. In an adaptive embodiment of the invention, the output y(n) resulting from the convolution between the transmitted symbols s(n) and the gain coefficients a.sub.j.Type: GrantFiled: November 10, 1988Date of Patent: May 15, 1990Assignee: National Semiconductor CorporationInventors: Roy G. Batruni, Howard A. Wilson