Abstract: A method and apparatus for manufacture and repair of thermally durable surface mounted device printed wiring assemblies which includes a printed wiring assembly having surface mounted devices thereon, which are attached to said wiring assembly by a quenched or rapidly soldified soldier joint. A method for manufacture and repair of such printed wiring assemblies is to heat the TWAs with SMDs thereon, above the solder melting temperature, and then expose the solder to a fluid below the solder melting temperature which is capable of absorbing heat rapidly from the solder. The intermediate solder joint is thereby rapidly solidified to achieve the advantages of the investive method.