Patents by Inventor HOWARD CHEUK WEI KU

HOWARD CHEUK WEI KU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240041142
    Abstract: Provided is an assembled simulation potted plant, including a pot body and plants; third. connecting portions are disposed on the pot body, at least two plants are provided, first connecting portions are disposed at lower parts of the plants, second connecting portions are disposed at upper parts of the plants, the connecting portions fit with the first connecting portion; a plurality of second connecting portions are disposed at an upper part, or a plurality of third connecting portions on the pot body are provided. In the present disclosure, the plants may be installed vertically in turn, the simulation potted plant has a great height variation range. Plants can be installed in the pot body, so the assembled simulation potted plant has a great horizontal dimension variation range, various different optimal states are greatly different; users may obtain a variety of greatly different potted plant shapes when purchasing one assembled simulation potted plant.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 8, 2024
    Inventors: BENEDICT WEI CHUN KU, HOWARD CHEUK WEI KU