Patents by Inventor Howard D. Goldberg
Howard D. Goldberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7274079Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).Type: GrantFiled: August 22, 2005Date of Patent: September 25, 2007Assignee: Input/Output, Inc.Inventors: Arjun Selvakumar, Howard D. Goldberg, Duli Yu, Matthew Ip, Martin A. Schmidt, James L. Marsh, Bing-Fai Fung, Philip Simon
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Patent number: 7152473Abstract: A sensor apparatus (104) includes a plural different spatial direction axis of sensitivity positioned sensor package containing sensor module (305) supported by a planar surface (345) within a cavity (340) of a housing (205) coupled to a first end cap (210) by a PC-board connection (355). Housing (205) is further coupled to first end cap (210) by a first coupling member (315) and a second coupling member (320) and is also coupled to an opposite second end cap (215) by a third coupling member (320) and a fourth coupling member (325). Interface sealing members (330a, 330b, 330c, 330d) seal between housing (205) and first end cap (210). Interface sealing members (335a, 335b, 335c, 335d) seal between housing (205) and second end cap (215).Type: GrantFiled: March 17, 2000Date of Patent: December 26, 2006Assignee: Input/Output, Inc.Inventors: Larry Rushefsky, Axel Sigmar, Howard D. Goldberg, W. Marc Stalnaker, Ray Rinne, Demetrios Balderes, Guido Lemke, Matthew Ip, Lawrence P. Behn, Klaus Domagalski, Lianzhong Yu, Arjun Selvakumar, Duli Yu, James L. Marsh, Peter Maxwell, David Morgan, Thomas Buie, Kees Faber, Sjoerd Altman, Richard Laroo
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Patent number: 6945110Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).Type: GrantFiled: July 21, 2004Date of Patent: September 20, 2005Assignee: Input/Output, Inc.Inventors: Arjun Selvakumar, Howard D. Goldberg, Duli Yu, Matthew Ip, Martin A. Schmidt, James L. Marsh, Bing-Fai Fung, Philip Simon
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Patent number: 6871544Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).Type: GrantFiled: March 16, 2000Date of Patent: March 29, 2005Assignee: Input/Output, Inc.Inventors: Arjun Selvakumar, Howard D. Goldberg, Duli Yu, Matthew Ip, Martin A. Schmidt, James L. Marsh, Bing-Fai Fung, Philip Simon
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Patent number: 6861587Abstract: A system for resiliently attaching a mass to a package. The system includes a mass, a housing, resilient couplings for resiliently attaching the mass to the housing, bumpers for slidingly supporting the mass, and electrical connections for electrically coupling the mass to the housing.Type: GrantFiled: March 15, 2000Date of Patent: March 1, 2005Assignee: Input/Output, Inc.Inventors: Arjun SelVakumar, James L. Marsh, Howard D. Goldberg, Duli Yu, W. Marc Stalnaker
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Patent number: 6617098Abstract: A merged-mask micro-machining process is provided that includes the application of a plurality of layers of masking material that are patterned to provide a plurality of etching masks.Type: GrantFiled: July 13, 1999Date of Patent: September 9, 2003Assignee: Input/Output, Inc.Inventors: Lianzhong Yu, Robert P. Ried, Howard D. Goldberg, Duli Yu
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Patent number: 6458513Abstract: A micro machined structure includes one or more temporary bridges for temporarily coupling the micro machined structure to a support structure.Type: GrantFiled: September 27, 1999Date of Patent: October 1, 2002Assignee: Input/Output, Inc.Inventors: Lianzhong Yu, Howard D. Goldberg, Duli Yu
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Patent number: 6315423Abstract: A micro machined mirror assembly is provided that includes a micro machined top cap, mirror, and bottom cap mounted onto a ceramic substrate. The micro machined mirror is resiliently supported by a pair of T-shaped hinges and includes travel stops that limit motion of the mirror in the z-direction. The top and bottom micro machined caps also include travel stops that limit motion of the mirror in the z-direction.Type: GrantFiled: July 13, 1999Date of Patent: November 13, 2001Assignee: Input/Output, Inc.Inventors: Duli Yu, Lianzhong Yu, Howard D. Goldberg, Martin A. Schmidt, Robert P. Ried
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Patent number: 5607566Abstract: Screen printing technology is employed in the batch fabrication of the contacts and polymeric membranes of solid-state ion-selective sensors. The process achieves high yield with very reproducible results. Moreover, membrane thickness can easily be predetermined, as it is directly related to the thickness of the screen or stencil. The process of the present invention is compatible with many integrated circuit manufacturing technologies, including CMOS fabrication. Advantageous polymeric membrane paste compositions include a polyurethane/hydroxylated poly(vinyl chloride) compound and a silicone-based compound in appropriate solvent systems to provide screen-printable pastes of the appropriate viscosity and thixotropy.Type: GrantFiled: October 3, 1994Date of Patent: March 4, 1997Assignee: The Board of Regents of the University of MichiganInventors: Richard B. Brown, Guen-Sig Cha, Howard D. Goldberg
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Patent number: 5511428Abstract: A sensor microstructure contact scheme is provided for making backside electrical, mechanical, fluidic, or other contact to mechanical microstructures. The contact scheme is applicable to pressure sensors, shear stress sensors, flow rate sensors, temperature sensors, resonant microactuators, and other microsensors and microactuators. The contact scheme provides a microelectromechanical sensor body and support structure for backside contact of the sensor body, and features a support wafer substrate having one or more through-wafer vias each with a lateral span on the dimension of microns and a span that is more narrow at the wafer front surface than at the wafer back surface. An insulating film covers a portion of the support wafer substrate and sidewalls of the vias--with the lateral via span at the front surface being open.Type: GrantFiled: June 10, 1994Date of Patent: April 30, 1996Assignee: Massachusetts Institute of TechnologyInventors: Howard D. Goldberg, Martin A. Schmidt