Patents by Inventor Howard D. Sanders

Howard D. Sanders has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8461620
    Abstract: An optically triggered semiconductor switch includes an anode metallization layer; a cathode metallization layer; a semiconductor between the anode metallization layer and the cathode metallization layer and a photon source. The semiconductor includes at least four layers of alternating doping in the form P-N-P-N, in which an outer layer adjacent to the anode metallization layer forms an anode and an outer layer adjacent the cathode metallization layer forms a cathode and in which the anode metallization layer has a window pattern of optically transparent material exposing the anode layer to light. The photon source emits light having a wavelength, with the light from the photon source being configured to match the window pattern of the anode metallization layer.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: June 11, 2013
    Assignee: Applied Pulsed Power, Inc.
    Inventors: Steven C. Glidden, Howard D. Sanders
  • Publication number: 20110284920
    Abstract: An optically triggered semiconductor switch includes an anode metallization layer; a cathode metallization layer; a semiconductor between the anode metallization layer and the cathode metallization layer and a photon source. The semiconductor includes at least four layers of alternating doping in the form P-N-P-N, in which an outer layer adjacent to the anode metallization layer forms an anode and an outer layer adjacent the cathode metallization layer forms a cathode and in which the anode metallization layer has a window pattern of optically transparent material exposing the anode layer to light. The photon source emits light having a wavelength, with the light from the photon source being configured to match the window pattern of the anode metallization layer.
    Type: Application
    Filed: May 19, 2011
    Publication date: November 24, 2011
    Applicant: APPLIED PULSED POWER, INC
    Inventors: Steven C. Glidden, Howard D. Sanders
  • Patent number: 7081711
    Abstract: A novel pulsed, neutralized ion beam source is provided. The source uses pulsed inductive breakdown of neutral gas, and magnetic acceleration and control of the resulting plasma, to form a beam. The beam supplies ions for applications requiring excellent control of ion species, low remittance, high current density, and spatial uniformity.
    Type: Grant
    Filed: October 27, 2004
    Date of Patent: July 25, 2006
    Assignee: Applied Pulsed Power, Inc.
    Inventors: Steven C. Glidden, Howard D. Sanders, John B. Greenly
  • Patent number: 7072196
    Abstract: A method for triggering a high voltage solid state switch comprised of a set of thyristors connected in series. Initiating switch turn-on requires command triggering of only the lowest voltage thyristor, thereby eliminating the need for expensive high voltage pulse transformers or optically isolated triggers. Triggering of one thyristor causes a redistribution of voltage across the switch, generating a current flowing through the snubber circuit across each untriggered thyristor. This current is coupled to the gate of each thyristor causing all of them to turn on simultaneously. This results in an inexpensive method for triggering a high voltage solid state switch.
    Type: Grant
    Filed: January 28, 2005
    Date of Patent: July 4, 2006
    Assignee: Applied Pulsed Power, Inc.
    Inventors: Steven C. Glidden, Howard D. Sanders
  • Patent number: 6982482
    Abstract: A package for one or more solid state devices in a single module that allows for operation at high voltage, high current, or both high voltage and high current. Low thermal resistance between the solid state devices and an exterior of the package and matched coefficient of thermal expansion between the solid state devices and the materials used in packaging enables high power operation. The solid state devices are soldered between two layers of ceramic with metal traces that interconnect the devices and external contacts. This approach provides a simple method for assembling and encapsulating high power solid state devices.
    Type: Grant
    Filed: February 24, 2004
    Date of Patent: January 3, 2006
    Assignee: Applied Pulsed Power, Inc.
    Inventors: Steven C. Glidden, Howard D. Sanders