Abstract: A method for customizing a printed circuit board comprises steps of registering a template to the PCB, the template having an opening in registration defining a volume on the PCB where a conductive trace or jumper is desired, placing a semi-liquid conductive polymer in the opening, removing the template, leaving a conductive polymer trace or jumper on the PCB, and curing the conductive polymer. The method is applied to load boards for IC test apparatus and to unique receptacles for coupling test sockets to load boards. Receptacles according to the invention have decoupling capacitors mounted through the receptacle, providing capacitor connection very near leads for devices under test in such apparatus. In an embodiment of the unique receptacle, a power plane is provided as well as a ground plane, allowing the receptacle to provide complete customization for more generic load boards. In another embodiment, power and ground sensing lines are brought to the unique receptacle as well.

Abstract: A load board for an IC test apparatus has a film of self-supporting material mounted by adhesive to one side of the load board, covering through-holes in the load board, but exposing contact pads on the surface to which the self-supporting film is mounted. In preparing the load board, a self-supporting film is cut to shape for the load board, and openings are made in areas where contact pads must be exposed to make contact with off-board circuitry. The film is then mounted to the load board by adhesive, which may be applied in conventional ways, such as by spraying or spreading. In some embodiments film is used that has a pre-applied adhesive and a protective film layer over the adhesive. In these embodiments, the protective film is peeled away, and the film is applied to the load board.