Abstract: There is provided an electronic package for mounting to a circuit board. The electronic package comprises a substrate having opposed first and second sides, at least one semiconductor component disposed on the first side of the substrate, a grid of electrically conductive nodes arranged on the second side of the substrate at a predetermined pitch, and at least one thermally conductive element disposed on the second side of the substrate. The thermally conductive element is coupled to at least one thermally conductive pathway. The thermally conductive pathway extends between the semiconductor component and the second side of the substrate through a thickness of the substrate to define at least one of the electrically conductive nodes and thermally couple the semiconductor component to the thermally conductive element. The thermally conductive element extends over the second side of the substrate by a distance of greater than or equal to the predetermined pitch.

Abstract: An electronic package for mounting to a circuit board is provided. The electronic package comprises a substrate, and first and second electronic modules. The substrate has opposed first and second sides. The first and second electronic modules are disposed on the second side of the substrate to be spaced apart from each other. Third and fourth electronic modules are disposed on the first side of the substrate and spaced apart from each other. The electronic package also comprises at least one wall section disposed between the first and second electronic modules. The at least one wall section is mounted on the second side of the substrate. The at least one wall section is configured to electromagnetically shield the first and second electronic modules from each other. Further provided are methods of forming the electronic package.

Abstract: A packaged module can include a packaging substrate having first and second side with a plurality of layers therebetween in a printed circuit board configuration and having a thickness that is less than 200 ?m, and a first-side portion including a first component mounted on the first side of the packaging substrate and a first mold structure implemented to at least partially encapsulate the first component. The packaged module can further include a second-side portion including a second component mounted on the second side of the packaging substrate and a plurality of conductive mounting structures. The second-side portion can further include a second mold structure implemented to at least partially encapsulate the second component, with the second mold structure further encapsulating the conductive mounting features while providing respective exposed mounting surfaces of the conductive mounting features.

Abstract: A dual sided molded package has a substrate with pads of varying size configured to receive electrically conductive interconnect members thereon. The pads include first pads that have a larger surface area than a surface area of second pads. In one implementation, one or more first pads are proximate the corners of the substrate. First interconnect members are attached to the first pads and second interconnect members are attached to the second pads. The first interconnect members have an exposed solderable area that is substantially equal to the surface area of the first pads, and the second interconnect members have an exposed solderable area that is substantially equal to the surface area of the second pads. The first exposed solderable area is larger than the second exposed solderable area.

Abstract: A packaged module can include a packaging substrate with first and sides, first and second components mounted on the first and second sides, respectively, and first and second overmolds implemented on the first and second sides, respectively, with the second overmold defining a mounting surface. The packaged module can further include a plurality of conductive features implemented on the second side of the packaging substrate to provide electrical connections for the packaged module, with the conductive features being formed from conductive material having a sufficiently high melting temperature so that the conductive features do not melt during a mounting operation. Each conductive feature can have a surface that is substantially coplanar with or recessed with respect to the mounting surface, and a solderable material layer can be dimensioned to cover the surface of each conductive feature.

Abstract: An electronic package is provided. The electronic package comprises a substrate having a first side and a second side, the substrate configured to receive one or more electronic components; a first electronic component mounted to the first side of the substrate; a first mold structure extending over at least part of the first side of the substrate; a group of through-mold connections provided on the first side of the substrate, the through-mold connections substantially formed of non-reflowable electrically conductive material; the first mold structure substantially encapsulating the group of through-mold connections; the group of through-mold connections exposed through the first mold structure. An electronic device comprising such an electronic package is also provided. A method of manufacturing such an electronic package is also provided.

Abstract: In some embodiments, a method for manufacturing packaged radio-frequency devices includes: providing a packaging substrate configured to receive a plurality of components, including a first side and a second side; mounting a first component on the first side of the packaging substrate; implementing a first overmold structure on the first side of the packaging substrate, substantially encapsulating the first component; mounting a second component on the second side of the packaging substrate, the second component being located in an area of the second side where one or more redundant pins, a redundant ground pad, or a redundant portion of a ground pad may be located; implementing a set of through-mold connections on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins; and implementing a second overmold structure substantially encapsulating one or more of the component or the set of through-mold connections.

Abstract: A packaged module can include a substrate having first and second sides, and a plurality of redistribution layers. The packaged module can further include a filter die implemented on the first side of the substrate, and a plurality of pins implemented on the second side of the substrate, such that the redistribution layers include a fan out circuit between the filter die and the pins. The packaged module can further include a passive element implemented as part of the redistribution layers and configured to support operation of the filter die.

Abstract: An electronics package has a recess formed in the top surface of a substrate, with a first die mounted on a bottom surface of the recess, a second die mounted on the top surface of the substrate adjacent to the recess, and a third die mounted on the top surface of the substrate adjacent to the recess opposite to the second die. A wirebond spans over the first die and interconnecting the second die and the third die.

Abstract: An electronics package has a recess formed in the top surface of a substrate, with a first die mounted on a bottom surface of the recess, and a second die mounted on the top surface of the substrate adjacent to the recess so that at least a portion of the second die forms an overhang over the first die

Abstract: An electronic package is provided. The electronic package comprises a substrate having a first side and a second side, the substrate configured to receive one or more electronic components; a first electronic component mounted to the first side of the substrate; a first mold structure extending over at least part of the first side of the substrate; a group of through-mold connections provided on the first side of the substrate, the through-mold connections substantially formed of non-reflowable electrically conductive material; the first mold structure substantially encapsulating the group of through-mold connections; the group of through-mold connections exposed through the first mold structure. An electronic device comprising such an electronic package is also provided. A method of manufacturing such an electronic package is also provided.

Abstract: A packaged semiconductor module comprises a substrate having a ground plane, an electronic device mounted on a surface of the substrate, a bond pad disposed on the surface of the substrate and electrically connected to the ground plane, a mold compound covering the electronic device, a conductive post disposed on a side of the electronic device, the conductive post extending from the bond pad and at least partially through the mold compound, and a conductive layer disposed on the mold compound and electrically coupled to the conductive post and to the ground plane, the conductive post, the conductive layer, and the ground plane together forming the integrated electromagnetic interference shield, the conductive post extending from the bond pad to the conductive layer in a direction perpendicular to a plane defined by the surface of the substrate.

Abstract: Devices and methods related to metallization of ceramic substrates for shielding applications. In some embodiments, a ceramic assembly includes a plurality of layers, the assembly including a boundary between a first region and a second region, the assembly further including a selected layer having a plurality of conductive features along the boundary, each conductive feature extending into the first region and the second region such that when the first region and the second region are separated to form their respective side walls, each side wall includes exposed portions of the conductive features capable of forming electrical connection with a conductive shielding layer.

Abstract: Signal isolation for module with ball grid array. In some embodiments, a packaged module can include a packaging substrate having an underside, and an arrangement of conductive features implemented on the underside of the packaging substrate to allow the packaged module to be capable of being mounted on a circuit board. The arrangement of conductive features can include a signal feature implemented at a first region and configured for passing of a signal, and one or more shielding features placed at a selected location relative to the signal feature to provide an enhanced isolation between the signal feature and a second region of the underside of the packaging substrate.

Abstract: A dual-sided module can include a redistribution layer having first and second sides, and a first-side portion implemented on the first side of the redistribution layer and including a first component mounted on the first side of the redistribution layer, and a first mold structure implemented to at least partially encapsulate the first component. The dual-sided module can further include a second-side portion implemented on the second side of the redistribution layer and including a second component mounted on the second side of the redistribution layer, a plurality of conductive mounting structures, and a second mold structure implemented to at least partially encapsulate the second component. The second mold structure can further encapsulate the conductive mounting features while providing respective exposed mounting surfaces of the conductive mounting features.

Abstract: A method for implementing a packaged radio-frequency device is disclosed, including providing a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side. The method includes implementing a package on the first side of the packaging substrate, the package including a first overmold structure. The method further includes implementing a set of through-mold connections on the second side of the packaging substrate, the set of through-mold connections defining a mounting area on the second side of the packaging substrate. The method also includes mounting a component to the second side of the packaging substrate. The method additionally includes implementing a second overmold structure on the second side, the second overmold structure substantially encapsulating at least a portion of the component and including an underside surface.

Abstract: Devices and methods related to metallization of ceramic substrates for shielding applications. In some embodiments, a ceramic assembly includes a plurality of layers, the assembly including a boundary between a first region and a second region, the assembly further including a selected layer having a plurality of conductive features along the boundary, each conductive feature extending into the first region and the second region such that when the first region and the second region are separated to form their respective side walls, each side wall includes exposed portions of the conductive features capable of forming electrical connection with a conductive shielding layer.

Abstract: In some embodiments, a method for manufacturing packaged radio-frequency devices includes: providing a packaging substrate configured to receive a plurality of components, including a first side and a second side; mounting a first component on the first side of the packaging substrate; implementing a first overmold structure on the first side of the packaging substrate, substantially encapsulating the first component; mounting a second component on the second side of the packaging substrate, the second component being located in an area of the second side where one or more redundant pins, a redundant ground pad, or a redundant portion of a ground pad may be located; implementing a set of through-mold connections on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins; and implementing a second overmold structure substantially encapsulating one or more of the component or the set of through-mold connections.

Abstract: Packaged modules can be manufactured by providing or forming a substrate panel having first and second sides, and an array of units, and mounting one or more devices on the first side of the substrate panel for each unit. A first mold layer can be formed over the first side of the substrate panel to provide an assembly, with the first mold layer having an initial thickness that is greater than a final thickness, such that the initial thickness is sufficiently large to prevent warpage of the assembly where a similar assembly having a first mold layer with the final thickness would warp. One or more process operations can be performed on the second side of the substrate panel of the assembly, and a thinning operation can reduce the thickness of the first mold layer from the initial thickness to the final thickness.

Abstract: Signal isolation for module with ball grid array. In some embodiments, a packaged module can include a packaging substrate having an underside, and an arrangement of conductive features implemented on the underside of the packaging substrate to allow the packaged module to be capable of being mounted on a circuit board. The arrangement of conductive features can include a signal feature implemented at a first region and configured for passing of a signal, and one or more shielding features placed at a selected location relative to the signal feature to provide an enhanced isolation between the signal feature and a second region of the underside of the packaging substrate.