Patents by Inventor Howard E. Harrell

Howard E. Harrell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of preventing aluminum bond pad corrosion during dicing of integrated circuit wafers
    Patent number: 5461008
    Abstract: A method of suppressing adherence of silicon particles to IC bond pads, and corrosion thereof, during the dicing of silicon wafers by sawing. An anion of an organic acid is added to saw coolant water.
    Type: Grant
    Filed: May 26, 1994
    Date of Patent: October 24, 1995
    Assignee: Delco Electronics Corporatinon
    Inventors: Richard M. Sutherland, Howard E. Harrell, Wayne A. Sozansky, George C. Wolf