Abstract: The disclosure is directed to an electronic device with a solder interconnect and multiple material encapsulant. The electronic device includes a die last assembly with the die assembled to an electronic packaging substrate by a solder interconnect. At least a portion of a first dielectric material and the die are milled or ground, with a second dielectric material applied over an exposed portion of the die. A shield is then positioned over and electrically insulated from the die. Accordingly, such a configuration reduces a thickness or height of an electronic device with shielding and a die last assembly.

Abstract: An electrically and mechanically operated competitive amusement game, simulating the game of table tennis. The game includes a display screen so arranged that a game can be simulated thereon where two players appear to hit a ball, in the form of a light image, back and forth on the screen. The game includes a serve button for initiating a serve at the beginning of the game. The players continue to "volley" the simulated ball back and forth by timely actuation of two "volleying" buttons until a miss is detected. When a miss is detected, the ball comes to rest and a new serve is initiated to start the process again.