Abstract: Embodiments of the present invention include a two-stage blending filter that blends the measurements from two angular sensors to form a single superior high bandwidth measurement for improved disturbance rejection in a satellite systems for increased accuracy in satellite pointing, orientation, and attitude control. Embodiments of the present invention can include a satellite system including a first sensor including or defining a first measurement bandwidth; a first filter connected to the first sensor; a second sensor including or defining a second measurement bandwidth; a second filter connected to the second sensor; and a third filter connected to the first filter and the second filter. The third filter blend the first signal and the second signal into a third signal; and transmit the third signal to a flight controller configured to adjust an orientation of the satellite, a satellite subsystem, or both, relative to a target in response to the third signal.

Abstract: Embodiments of the present invention include a two-stage blending filter that blends the measurements from two angular sensors to form a single superior high bandwidth measurement for improved disturbance rejection in a satellite systems for increased accuracy in satellite pointing, orientation, and attitude control. Embodiments of the present invention can include a satellite system including a first sensor including or defining a first measurement bandwidth; a first filter connected to the first sensor; a second sensor including or defining a second measurement bandwidth; a second filter connected to the second sensor; and a third filter connected to the first filter and the second filter. The third filter blend the first signal and the second signal into a third signal; and transmit the third signal to a flight controller configured to adjust an orientation of the satellite, a satellite subsystem, or both, relative to a target in response to the third signal.

Abstract: Systems, methods, and apparatus for a disk resonator gyroscope are disclosed. In one or more embodiments, the disclosed method involves sensing, by at least one first axis sensor/driver electrode associated with a first axis of a resonator, motion associated with the resonator. The method further involves driving at least one first axis sensor/driver electrode with a first axis actuation signal produced by first axis drive circuitry associated with the first axis of the resonator. Also, the method involves sensing, by at least one second axis sensor/driver electrode associated with a second axis of the resonator, the motion associated with the resonator. Further, the method involves driving at least one second axis sensor/driver electrode with a second axis actuation signal produced by second axis drive circuitry associated with the second axis of the resonator.

Abstract: A gyroscope system may include a disc resonator gyroscope including a plurality of electrodes embedded in the disc resonator gyroscope. The electrodes may be configured for at least applying a drive voltage and a tuning voltage to the disc resonator gyroscope and for sensing operating parameters of the disc resonator gyroscope. The gyroscope system may also include a quadrature stabilization circuit configured to measure a quadrature error and generate a quadrature regulating voltage based on the quadrature error. The tuning voltage may be adjusted by the quadrature regulating voltage to cancel an effect of voltage flicker before being applied to a tuning electrode of the disc resonator gyroscope.

Abstract: A gyroscope system may include a disc resonator gyroscope including a plurality of electrodes embedded in the disc resonator gyroscope. The electrodes may be configured for at least applying a drive voltage and a tuning voltage to the disc resonator gyroscope and for sensing operating parameters of the disc resonator gyroscope. The gyroscope system may also include a quadrature stabilization circuit configured to measure a quadrature error and generate a quadrature regulating voltage based on the quadrature error. The tuning voltage may be adjusted by the quadrature regulating voltage to cancel an effect of voltage flicker before being applied to a tuning electrode of the disc resonator gyroscope.

Abstract: Micromachined disc resonator gyroscopes (DRGs) are disclosed designed to be virtually immune to external temperature and stress effects. The DRG is a vibratory gyroscope that measures angular rate which is designed to have reduced sensitivity to external thermal and mechanical stress. The DRG features an integrated isolator that may be fabricated on the same wafer as the electrode wafer forming a plurality of integrated isolator beams. In addition, the DRG may include a wafer level hermetical vacuum seal, flip chip ball grid array (BGA), and vertical electrical feedthrough to improve reliability and to reduce manufacturing cost. An additional carrier layer may be used with shock stops, vertical electrical feedthrough, and the flip chip BGA. A pyrex or quartz cap with embedded getter and shock stops can be employed.

Abstract: A micromachined thermal and mechanical isolator for MEMS die that may include two layers, a first layer with an active temperature regulator comprising a built-in heater and temperature sensor and a second layer having mechanical isolation beams supporting the die. The isolator may be inserted between a MEMS die of a disc resonator gyroscope (DRG) chip and the leadless chip carrier (LCC) package to isolate the die from stress and temperature gradients. Thermal and mechanical stress to the DRG can be significantly reduced in addition to mitigating temperature sensitivity of the DRG chip. The small form can drastically reduce cost and power consumption of the MEMS inertial sensor and enable new applications such as smart munitions, compact and integrated space navigation solutions, with significant potential cost savings over the existing inertial systems.

Abstract: A single layer micromachined thermal and mechanical isolator may be bonded between a microelectromechanical system (MEMS) die and package. Small bond pads of the isolator are attached to the periphery of the die. The isolator material may be chosen to match that of the die, reducing CTE mismatch. Long thin isolation beams can be used to provide thermal isolation against external temperature changes, which may be conducted through the package. Weak and flexible beams can be used to tolerate large displacements with very little resistance. Thus, excessive stress or distortion to the package, from either CTE mismatch or external stress, may be absorbed by the isolator and will not be transmitted to the MEMS die. Beam rigidity may be designed to attenuate vibration of particular frequency range. The isolator can be readily inserted into an existing disc resonator gyroscope package in one thermal compression bond step.

Abstract: A resonator and method of making a resonator are provided. A particular method includes etching a silicon substrate to form a resonator structure. The resonator structure includes at least one resonator beam. The method also includes converting at least a portion of the at least one resonator beam to dry oxide.

Abstract: A micromachined thermal and mechanical isolator for MEMS die that may include two layers, a first layer with an active temperature regulator comprising a built-in heater and temperature sensor and a second layer having mechanical isolation beams supporting the die. The isolator may be inserted between a MEMS die of a disc resonator gyroscope (DRG) chip and the leadless chip carrier (LCC) package to isolate the die from stress and temperature gradients. Thermal and mechanical stress to the DRG can be significantly reduced in addition to mitigating temperature sensitivity of the DRG chip. The small form can drastically reduce cost and power consumption of the MEMS inertial sensor and enable new applications such as smart munitions, compact and integrated space navigation solutions, with significant potential cost savings over the existing inertial systems.

Abstract: A resonator and method of making a resonator are provided. A particular method includes etching a silicon substrate to form a resonator structure. The resonator structure includes at least one resonator beam. The method also includes converting at least a portion of the at least one resonator beam to dry oxide.

Abstract: Micromachined disc resonator gyroscopes (DRGs) are disclosed designed to be virtually immune to external temperature and stress effects. The DRG is a vibratory gyroscope that measures angular rate which is designed to have reduced sensitivity to external thermal and mechanical stress. The DRG features an integrated isolator that may be fabricated on the same wafer as the electrode wafer forming a plurality of integrated isolator beams. In addition, the DRG may include a wafer level hermetical vacuum seal, flip chip ball grid array (BGA), and vertical electrical feedthrough to improve reliability and to reduce manufacturing cost. An additional carrier layer may be used with shock stops, vertical electrical feedthrough, and the flip chip BGA. A pyrex or quartz cap with embedded getter and shock stops can be employed.

Abstract: A single layer micromachined thermal and mechanical isolator may be bonded between a microelectromechanical system (MEMS) die and package. Small bond pads of the isolator are attached to the periphery of the die. The isolator material may be chosen to match that of the die, reducing CTE mismatch. Long thin isolation beams can be used to provide thermal isolation against external temperature changes, which may be conducted through the package. Weak and flexible beams can be used to tolerate large displacements with very little resistance. Thus, excessive stress or distortion to the package, from either CTE mismatch or external stress, may be absorbed by the isolator and will not be transmitted to the MEMS die. Beam rigidity may be designed to attenuate vibration of particular frequency range. The isolator can be readily inserted into an existing disc resonator gyroscope package in one thermal compression bond step.