Patents by Inventor Howard Heemstra

Howard Heemstra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soybean-based adhesive resins and composite products utilizing such adhesives
    Patent number: 6518387
    Abstract: The present invention relates to a soybean-based adhesive resin including a soybean flour and a cross-linking agent. The cross-linking agent is reacted with the functional groups in the soybean flour to form an adhesive resin. The present invention also relates to a method of making a soybean-based adhesive resin. This method involves providing an aqueous solution of soybean flour and adding a cross-linking agent to the solution under conditions effective to cross-link the soybean flour so that an adhesive resin is formed. Also disclosed is a composite product which includes particulate plant material and the soybean-based adhesive resin. The adhesive is prepared by reacting the cross-linking agent with the functional groups in the soybean flour. The present invention also relates to a method of making a composite product by providing particulate plant material and applying the soybean-based adhesive resin to the particulate plant material.
    Type: Grant
    Filed: September 4, 2001
    Date of Patent: February 11, 2003
    Assignee: Iowa State University Research Foundation, Inc.
    Inventors: Monlin Kuo, Deland J. Myers, Howard Heemstra, Daniel Curry, Daniel O. Adams, Douglas D. Stokke
  • Soybean-based adhesive resins and composite products utilizing such adhesives
    Publication number: 20020026025
    Abstract: The present invention relates to a soybean-based adhesive resin including a soybean flour and a cross-linking agent. The cross-linking agent is reacted with the functional groups in the soybean flour to form an adhesive resin. The present invention also relates to a method of making a soybean-based adhesive resin. This method involves providing an aqueous solution of soybean flour and adding a cross-linking agent to the solution under conditions effective to cross-link the soybean flour so that an adhesive resin is formed. Also disclosed is a composite product which includes particulate plant material and the soybean-based adhesive resin. The adhesive is prepared by reacting the cross-linking agent with the functional groups in the soybean flour. The present invention also relates to a method of making a composite product by providing particulate plant material and applying the soybean-based adhesive resin to the particulate plant material.
    Type: Application
    Filed: September 4, 2001
    Publication date: February 28, 2002
    Inventors: Monlin Kuo, Deland J. Myers, Howard Heemstra, Daniel Curry, Daniel O. Adams, Douglas D. Stokke
  • Soybean-based adhesive resins and composite products utilizing such adhesives
    Patent number: 6306997
    Abstract: The present invention relates to a soybean-based adhesive resin including a soybean flour and a cross-linking agent. The cross-linking agent is reacted with the functional groups in the soybean flour to form an adhesive resin. The present invention also relates to a method of making a soybean-based adhesive resin. This method involves providing an aqueous solution of soybean flour and adding a cross-linking agent to the solution under conditions effective to cross-link the soybean flour so that an adhesive resin is formed. Also disclosed is a composite product which includes particulate plant material and the soybean-based adhesive resin. The adhesive is prepared by reacting the cross-linking agent with the functional groups in the soybean flour. The present invention also relates to a method of making a composite product by providing particulate plant material and applying the soybean-based adhesive resin to the particulate plant material.
    Type: Grant
    Filed: July 29, 1999
    Date of Patent: October 23, 2001
    Assignee: Iowa State University Research Foundation, Inc.
    Inventors: Monlin Kuo, Deland J. Myers, Howard Heemstra, Daniel Curry, Daniel O. Adams, Douglas D. Stokke