Patents by Inventor Howard Ho Man Chu

Howard Ho Man Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes
    Patent number: 9475963
    Abstract: An ACF comprising a substrate, a layer of an adhesive on the surface of the substrate, the adhesive optionally having conductive particles dispersed therein, at least one tier of conductive particles arranged in a non-random array, the tier being formed by transfer of conductive particles from a carrier belt having a stitching line to the surface of the adhesive layer wherein the portion of the tier corresponding to the stitching line is free of conductive particles, and the adhesive layer being overcoated with a second tier of conductive particles arranged in a non-random array at least in the area of the first tier corresponding to the stitching line. The tiers may be at the same or different depths within the adhesive layer. More than two tiers of conductive particles may be present in the ACF.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: October 25, 2016
    Assignee: TRILLION SCIENCE, INC.
    Inventors: Rong-Chang Liang, Jane Sun, Howard Ho Man Chu, Meng-Chun Lee
  • FIXED ARRAY ACFs WITH MULTI-TIER PARTIALLY EMBEDDED PARTICLE MORPHOLOGY AND THEIR MANUFACTURING PROCESSES
    Publication number: 20150240130
    Abstract: An ACF comprising a substrate, a layer of an adhesive on the surface of the substrate, the adhesive optionally having conductive particles dispersed therein, at least one tier of conductive particles arranged in a non-random array, the tier being formed by transfer of conductive particles from a carrier belt having a stitching line to the surface of the adhesive layer wherein the portion of the tier corresponding to the stitching line is free of conductive particles, and the adhesive layer being overcoated with a second tier of conductive particles arranged in a non-random array at least in the area of the first tier corresponding to the stitching line. The tiers may be at the same or different depths within the adhesive layer. More than two tiers of conductive particles may be present in the ACF.
    Type: Application
    Filed: May 14, 2015
    Publication date: August 27, 2015
    Inventors: Rong-Chang Liang, Jane Sun, Howard Ho Man Chu, Meng-Chun Lee