Abstract: Among other things, advertisements are received for brands or products of brands. Criteria for placement of the advertisements are received at online retail sites. The online retail sites are controlled independently from one another. Inventory data for the products at the online retail sites is received and stored. Data about propensities of the consumers to favor one or more of the brands or one or more products of the brands, from activities of consumers on the online retail sites, is stored. Activity data about current activities of the consumers on the online retail sites is received. One or more of the advertisements are placed on pages served to the online retail sites based on the placement data, the inventory data, the propensity data, and the activity data. Conversion data is received indicating that consumers engaged in conversion events with respect to products associated with the brands or products of brands being advertised.

Abstract: A vertical probe card for testing electronic devices includes a multi-layer ceramic substrate mounted on a printed circuit board. The multi-layer ceramic substrate provides a plurality of vertical probes arranged in a planar array and formed on the surface of the multi-layer ceramic substrate by micro-fabrication technology. The method of using the vertical probe card includes disposing a device to be tested under the card, aligning the card's probes with the I/O terminals of the device, and contacting the device with the card's ceramic substrate so that all of the contact portions of the I/O terminals are contacted and deformed by the probes. The relative positions of the electronic device and the apparatus are maintained while Automatic Test Equipment tests the device.

Abstract: Micro-fabrication forms a plurality of stiff vertical micro probes on the front surface of a ceramic substrate and a plurality of contacts on the back surface of the ceramic substrate. Photolithography, various etching technologies and electroplating are used to form the micro probes on the surface of the ceramic substrate. The produced micro probes are mechanically strong and consequently have a long duty life. Moreover, the probes can be arranged into a high-density planar array to conform to the newest integrated circuit devices which have dense I/O terminal arrays.

Abstract: A method for testing a printed circuit board (PCB), such as the FCP or CSP substrate, employs a ceramic substrate with multiple micro-probes formed on the ceramic substrate. The micro-probes are formed in a high density arrangement to electrically contact conductive vias defined on the PCB. The ceramic substrate further connects to a test apparatus. The test apparatus can output test signals through the micro-probes to the conductive vias on the PCB. Thereafter, the test apparatus can check and determine whether the PCB is normal or not. When applying the method to test PCBs, the required testing time can be greatly reduced, even when employing the testing method on a PCB with high-density conductive vias.

Abstract: A vertical probe card for testing electronic devices includes a multi-layer ceramic substrate mounted on a printed circuit board. The multi-layer ceramic substrate provides a plurality of vertical probes arranged in a planar array and formed on the surface of the multi-layer ceramic substrate by micro-fabrication technology. The method of using the vertical probe card includes disposing a device to be tested under the card, aligning the card's probes with the I/O terminals of the device, and contacting the device with the card's ceramic substrate so that all of the contact portions of the I/O terminals are contacted and deformed by the probes. The relative positions of the electronic device and the apparatus are maintained while Automatic Test Equipment tests the device.

Abstract: An apparatus to heat and test a semiconductor wafer includes a probe card and tests a plurality of die simultaneously at the wafer level. In the present invention, the apparatus heats the wafer to sufficient temperatures to perform burn-in and a speed test. A method of testing the semiconductor allows certain die to be repaired that would otherwise be scrapped in a conventional process where bun-in and other tests are performed on packaged die. The method also eliminates steps associated with handling individually packaged parts, reduces burn-in space and consolidates certain test steps.

Abstract: A telecommunications system receives a call back request though a separately maintained computer network, such as an X.25 based computer network, and initiates the actual call back toward the requesting subscriber using its own Signaling System No. 7 (SS7) telecommunications network. If the call back request fails, an X.25 packet containing an error code is transmitted back to the originating subscriber over the separately maintained computer network. An X.25<=>TCAP converter is used as an interface card to allow X.25 packets to communicate freely with TCAP based telecommunications network.