Abstract: A shaped soldering strip for promoting improved soldering joints to or between a tube array comprising: a thin coupon of solder having margins defining openings aligned with the axes of the tubes to be joined; a collar surrounding each margin to define a cup shape integral with the associated margin, such margin forming the bottom of said cup shape and being positioned by the collar for placement in annular contact or at least in micro-close proximity to the external circumference of an aligned tube to limit downward weepage of flux deposited in said cup shape: and bridges connecting said collars to create said coupon that extends over said frontal area and gangs the collars for positioning on the tubes of said array.