Abstract: A wide dynamic range mixer which has a high linearity passive balun fabricated on a Si substrate for receiving an input RF signal and an active balun for receiving a local oscillator signal. The active balun includes high frequency, low voltage SiGe transistors to achieve low power amplification of the local oscillator signal. The output signals of the baluns are provided to a non-linear diode quad mixer device which provides a desired IF signal.

Abstract: A capacitive type MEMS switch having a conductor arrangement comprised of first and second RF conductors deposited on a substrate. A bridge member having a central enlarged portion is positioned over the conductor arrangement. In one embodiment, the first RF conductor has an end defining an open area in which is positioned a pull down electrode, with the end of the first RF conductor substantially surrounding the pull down electrode. In another embodiment, two opposed RF conductors, each having ends with first and second branches, define an open area in which a pull down electrode is positioned. A dielectric layer is deposited on the conductor arrangement such that when a pull down voltage is applied to the pull down electrode, the switch impedance is significantly reduced so as to allow signal propagation between the RF conductors.

Abstract: A capacitive type MEMS switch having a conductor arrangement comprised of first and second RF conductors deposited on a substrate. A bridge member having a central enlarged portion is positioned over the conductor arrangement. In one embodiment, the first RF conductor has an end defining an open area in which is positioned a pull down electrode, with the end of the first RF conductor substantially surrounding the pull down electrode. In another embodiment, two opposed RF conductors, each having ends with first and second branches, define an open area in which a pull down electrode is positioned. A dielectric layer is deposited on the conductor arrangement such that when a pull down voltage is applied to the pull down electrode, the switch impedance is significantly reduced so as to allow signal propagation between the RF conductors.

Abstract: A footprint for adaptable MMIC arrays is disclosed in which the size, number and location of the array components is optimized for the fabrication by depositing a personalizing metal interconnecting layer on the array, of essentially any MMIC circuit from a single footprint layout.

Abstract: Mini-microstrip and mini-coplanar transmission lines are formed on a ship substrate with two metal layers. Together with a ground plane on the underside of the substrate, the lines are connected to form a Marchand balun. Two baluns, a quarter-wave transmission line and a diode quad are combined on a chip to form an MMIC mixer, and a par of mixers are combined with 90.degree. and 180.degree. splitters to provide circuits with superior rejection of specific spurious signals as well as RF and LO leakage over.

Abstract: A footprint for adaptable MMIC arrays is disclosed in which the size, number and location of the array components is optimized for the fabrication by depositing a personalizing metal interconnecting layer on the array, of essentially any MMIC circuit from a single footprint layout.