Abstract: A wastewater treatment device evaporates water from contaminant containing wastewater, to produce a contaminant concentrated residue. The device includes a transport, such as pump, for transporting wastewater to a wastewater applicator, and a wastewater applicator for applying the wastewater to an evaporating surface of an evaporator drum. A rotatable evaporator drum has a heat conductive evaporating surface, and a heater for heating the evaporating surface to foster the evaporation of water from the wastewater. A motor, chain and drive shaft are provided for rotating the evaporator drum, and a scraper is provided for removing the contaminant concentrated residue from the evaporating surface. A controller is provided for controlling the operation of the device.

Abstract: A leaf guard and strainer assembly for use in the downspout of a roof gutter is disclosed which tends to prevent the downspout from being clogged with leaves and debris while permitting water in the gutter to flow around the sides of the assembly and around the sides of a barrier of leaves and debris piled against the assembly so as to enter the downspout from the sides of the assembly which face the opposing gutter sidewalls. The assembly includes a base plate containing an opening adapted to fit upon the gutter floor over an entrance to the downspout so that the opening and entrance communicate. Also included is a plurality of U-shaped ribs, the legs of which are inserted downwardly through the plate on opposite sides of the opening, lower free end portions of which project below the plate into the downspout. An elongated rigid beam member is connected to the upper ends of the ribs to maintain the desired spacing between them.

Abstract: A vertical solder coating machine is described incorporating a tank containing molten solder with a bath of solder leveling fluid on the top thereof. Drive rollers are positioned within the tank and in the solder leveling fluid for grasping workpieces such as a printed circuit board and lowering the workpiece through the solder leveling fluid into the molten solder. The workpiece is forced into the molten solder until it is no longer gripped by the drive rollers and is trapped in the space formed by the rollers in contact with each other. When the rollers reverse direction, the workpiece is withdrawn through the solder leveling fluid and past a pair of leveling tubes positioned in the bath on either side of the workpiece. The leveler tubes direct a stream of solder leveling fluid onto the surface of the workpiece to level the solder thickness and remove solder from within any through-holes in the workpiece. The drive rollers are tapered and thus contact the workpiece only along opposite edges thereof.