Abstract: An electronic device, such as an integrated circuit formed on a single semiconductor chip, is mounted on a relatively flat insulative substrate, such as a chip carrier or printed circuit board, and electrically connected to electrical conductors on the substrate by means of a bonding material disposed between the device and substrate. The device is placed on the substrate with its electrically active surface in facing relationship with the substrate and with its electrical contact pads in registration with selected ones of the substrate conductors. The bonding material is substantially electrically conductive only along one axis which is orthogonal to the major planes of the device and substrate to provide an electrically conductive path between the contact pads and electrical conductors. The bonding material is allowed to accumulate along the perimeter of the electronic device to form a protective seal between the electronic device and the substrate.

Abstract: A data processing system is disclosed having data processing means for providing data in either an encoded format or in a display format in respective first and second operating modes. Data display means responsive to the operating mode of the data processing means are provided for receiving the data provided thereby, converting any data received in the encoded format to the display format, and displaying all received data in the display format.