Abstract: An optical interconnect may include an array of microLEDs driven to generate light based on data and/or clock signals, an array of photodetectors to receive the light and generate electrical signals corresponding to the data and/or clock signals, and optical fibers providing at least part of a pathway between the microLEDs and the photodetectors. A reflector structure for each of the microLEDs assists in coupling light from the microLEDs into the optical fibers. The reflector structure may be in the form of a compound parabolic concentrator (CPC).

Abstract: A multi-chip package may include a system-on-chip (SoC) and an optical IO subassembly on a common substrate. The SoC and the optical IO subassembly may be linked by a die-to-die interface. The optical IO subassembly may include an optical IO IC with microLEDs and/or photodetectors bonded to a surface of the optical IO IC away from the common substrate. An optical window layer may shield optical elements of the optical IO subassembly from damage relating to molding compound related operations during assembly.

Abstract: A microLED-based optical interconnect may include an optical coupling assembly having a first optical coupling subassembly and a second optical coupling subassembly, which may be coupled together. The first optical coupling subassembly may interface to an IC having an array of optoelectronics devices on its surface. The second optical coupling assembly may receive an end of a fiber optic bundle. Both the first optical coupling subassembly and the second optical coupling subassembly may include optical elements in an optical path between the array of optoelectronic devices and the end of the fiber optic bundle. The optoelectronic devices may be microLEDs or photodetectors.

Abstract: A connector assembly for a fiber-optic bundle may provide for a ninety degree bend in the fiber-optic bundle. The connector assembly may be used in a microLED-based optical interconnect. The microLED-based optical interconnect may provide for data and/or clock communication from an array of microLEDs to an array of photodetectors, with a fiber-optic bundle providing an optical transmission medium coupling light between the microLEDs and the photodetectors. Fiber elements of the fiber-optic bundle may be bound together about ends of the fiber elements, but loose in an area of the bend.

Abstract: Structures to isolate optical coupling elements from contamination during certain steps in assembling a parallel microLED optical link are disclosed. The structures include a dam structure around a coupling optics block, for coupling light from and/or to microLEDs and/or photodetectors, respectively, that would sit flush to a ferrule or connector that holds an optical transmission medium. The ferrule may be, for example, a multi-fiber push on (MPO) connector or an MTP connector.