Abstract: A specially designed electronic component is surface mounted on a printed circuit board substrate member having a spaced series of electrically conductive circuitry connection portions disposed on a side surface thereof. The electronic component has a body portion with a spaced series of elongated metal lead members fixedly secured thereto and projecting outwardly therefrom. Longitudinal portions of the lead members are soldered to the circuitry connection portions. Side surface areas of these longitudinal portions are clad with a second metal material having a coefficient of thermal expansion substantially different than that of the underlying longitudinal lead member portions. During fabrication of the circuit board a solder paste material is deposited on the circuitry connection portions and the lead member longitudinal portions are placed in a closely adjacent, aligned relationship with the circuitry connection portions.

Abstract: Electrical leads are provided for improving access to high density electronic devices. The leads include a polymeric dielectric core comprising a metallic conductive layer having at least two separate conductive paths thereon. The conductive paths are ideally suited to connect a pair of terminals disposed on a circuit element to a pair of conductive surfaces on a printed circuit board, without requiring any additional surface area to meet the lead requirements.

Abstract: Thermally reactive lead assemblies and electronic circuits are provided which include a solderable, conductive metallic element having a first configuration at ambient temperature and a second expanded configuration at an elevated temperature, such as at soldering temperatures. The second configuration of the conductive metallic element provides electrical continuity between a pair of soldering locations of the electronic circuit, such as between a semiconductor device lead and a conductive surface on a printed circuit board.

Abstract: Wicking-resistant solder preforms and methods for making such preforms are provided. The preforms include a solder layer for electrically mounting a lead to a printed circuit board upon heating the solder above its flow temperature. The preform also includes a flux layer disposed in contact with the solder layer and a wicking barrier disposed on a component-facing side of the solder layer for minimizing solder wicking along the lead during subsequent reflow soldering operations.

Abstract: Process vapors are condensed and recovered by bubbling a vapor up through a bed of inert particulate material, immersed in a liquid. The particulate material is supported on a perforated member in a container, with a condensate collecting chamber at the bottom. The condensate collects below the liquid. The vapor is fed through a diffuser positioned below the bed and condensate can be recycled to backwash the bed. The liquid temperature is controlled, together with the liquid level, liquid pH and also vapor flow rate.