Abstract: A method is provided for forming a thin film resistor (TFR) and a thin film MIM capacitor (TFMIMCAP) in an integrated circuit (IC) device. A method comprises: forming a thin film layer over an integrated circuit (IC) structure; annealing the thin film layer; forming a thin film sacrificial hardmask on the thin film layer; forming first and second thin film elements in the thin film layer; and removing the thin film sacrificial hardmask. An integrated circuit device comprises: an integrated circuit (IC) structure; an annealed thin film layer above the IC structure; and first and second thin film elements in the thin film layer, wherein the integrated circuit device does not comprise a thin film hardmask.

Abstract: A collapsible trolley includes a frame, a carrier plate, two wheel units, a primary grip and two auxiliary grip units. The frame includes two lower tubes and two upper tubes each pivotally connected to a corresponding one of the lower tubes. The carrier plate is connected to the lower tubes. Each of the wheel units is connected to a corresponding one of the lower tubes. The primary grip is supported on the upper tubes. Each of the auxiliary grip units is pivotally connected to a corresponding one of the upper tubes.