Abstract: Thermal control of a multi-chip module in an operating environment is facilitated by predetermining separate thermal control points for multiple chips of the multi-chip module, with a first chip and a second chip having different predetermined thermal control points, and saving the predetermined thermal control points for reference by a thermal control of the multi-chip module in an operating environment. The thermal control monitors an operating temperature of the first chip, and compares the operating temperature of the first chip to the predetermined thermal control point of that chip. The thermal control further initiates a control action to control temperature of the first chip based on comparing the operating temperature of the first chip to the predetermined thermal control point of the first chip.

Abstract: Thermal control of a multi-chip module in an operating environment is facilitated by predetermining separate thermal control points for multiple chips of the multi-chip module, with a first chip and a second chip having different predetermined thermal control points, and saving the predetermined thermal control points for reference by a thermal control of the multi-chip module in an operating environment. The thermal control monitors an operating temperature of the first chip, and compares the operating temperature of the first chip to the predetermined thermal control point of that chip. The thermal control further initiates a control action to control temperature of the first chip based on comparing the operating temperature of the first chip to the predetermined thermal control point of the first chip.

Abstract: A system for cooling a heat generating enclosure includes a first array of one or more fans of a first size and a second array of one or more fans of a second size, where the second array is in series to the first array. The system also includes a measuring unit configured to measure at least one process variable. The system also includes a control unit configured to control at least one of the fans in the first array or at least one of the fans in the second array based on the process variable, wherein the fans are controlled to achieve an optimization criterion.

Abstract: A method of cooling a heat generating enclosure includes setting a speed of each fan in a first array of fans, wherein each fan in the first array of fans is a first size, is disclosed. The method further includes measuring a process variable. The method also includes calculating a cooling strategy based at least in part on the value of the process variable. The method further includes setting the speed of each fan in the first array of fans or the speed of each fan in a second array of fans, wherein the second array of fans is in series to the first array of fans and each fan in the second array of fans is a second size, and wherein the speed of each fan that is set in the first or second array is set to implement the cooling strategy.

Abstract: A server rack door has a first dimension and a second dimension orthogonal to the first dimension and includes a first group of first obstructions arranged along the first dimension. The first obstructions define a first plurality of flow channels. The server rack door further includes a second group including second obstructions arranged along the first dimension and offset from the first obstructions along the second dimension. The second dimension corresponds to a thickness of the server rack door. The second obstructions define a second plurality of flow channels, where the first obstructions and the second obstructions alternate along the first dimension.

Abstract: A server rack door has a first dimension and a second dimension orthogonal to the first dimension and includes a first group of first obstructions arranged along the first dimension. The first obstructions define a first plurality of flow channels. The server rack door further includes a second group including second obstructions arranged along the first dimension and offset from the first obstructions along the second dimension. The second dimension corresponds to a thickness of the server rack door. The second obstructions define a second plurality of flow channels, where the first obstructions and the second obstructions alternate along the first dimension.

Abstract: A fan assembly system includes two or more circular fans, each fan situated in a round fan assembly, where each fan can be situated in the round fan assembly in any orientation. The system also includes a concentrically symmetric connector for each circular fan, located in a center of each circular fan. The system also includes a latching mechanism for each circular fan, where the latching mechanism is wholly contained within a swept area of a fan blade of the circular fan. The circular fans are arranged in a staggered arrangement, and the staggered arrangement of circular fans increases a number of circular fans that can be placed in the fan assembly system compared to a non-staggered arrangement.

Abstract: A server rack door has a first dimension and a second dimension orthogonal to the first dimension and includes a first group of first obstructions arranged along the first dimension. The first obstructions define a first plurality of flow channels. The server rack door further includes a second group including second obstructions arranged along the first dimension and offset from the first obstructions along the second dimension. The second dimension corresponds to a thickness of the server rack door. The second obstructions define a second plurality of flow channels, where the first obstructions and the second obstructions alternate along the first dimension.

Abstract: Disclosed aspects relate to cooling electronics. A set of recirculation flaps is coupled with a cooling fan. At least one recirculation flap has a ferrous material. In various embodiments, the set of recirculation flaps is arranged in an open position in response to air pressure from the cooling fan, and is arranged in a closed position in response to substantially no air pressure from the cooling fan. A controller is coupled with the cooling fan. The controller indicates a set of indicated positions for the set of recirculation flaps based on a tachometer value. An electromagnet is connected with the controller to position the set of recirculation flaps in the set of indicated positions using the ferrous material. In various embodiments, the electromagnet engages the ferrous material to arrange the set of recirculation flaps in an open position.

Abstract: Disclosed aspects relate to cooling electronics. A set of recirculation flaps is coupled with a cooling fan. At least one recirculation flap has a ferrous material. In various embodiments, the set of recirculation flaps is arranged in an open position in response to air pressure from the cooling fan, and is arranged in a closed position in response to substantially no air pressure from the cooling fan. A controller is coupled with the cooling fan. The controller indicates a set of indicated positions for the set of recirculation flaps based on a tachometer value. An electromagnet is connected with the controller to position the set of recirculation flaps in the set of indicated positions using the ferrous material. In various embodiments, the electromagnet engages the ferrous material to arrange the set of recirculation flaps in an open position.

Abstract: A heatsink structure cools a first electronic chip and a second electronic chip that are positioned serially and in-line to one or more cooling fan, such that cooling air from the cooling fan(s) passes above the first electronic chip before passing above the second electronic chip. The heatsink structure includes a first heatsink and a second heatsink, which are identical to each other, and which fit adjacent to one another when a first heatsink is rotated 180 degrees relative to the second heatsink.

Abstract: A fan assembly system includes two or more circular fans, each fan situated in a round fan assembly, where each fan can be situated in the round fan assembly in any orientation. The system also includes a concentrically symmetric connector for each circular fan, located in a center of each circular fan. The system also includes a latching mechanism for each circular fan, where the latching mechanism is wholly contained within a swept area of a fan blade of the circular fan. The circular fans are arranged in a staggered arrangement, and the staggered arrangement of circular fans increases a number of circular fans that can be placed in the fan assembly system compared to a non-staggered arrangement.

Abstract: A server rack door has a first dimension and a second dimension orthogonal to the first dimension and includes a first group of first obstructions arranged along the first dimension. The first obstructions define a first plurality of flow channels. The server rack door further includes a second group including second obstructions arranged along the first dimension and offset from the first obstructions along the second dimension. The second dimension corresponds to a thickness of the server rack door. The second obstructions define a second plurality of flow channels, where the first obstructions and the second obstructions alternate along the first dimension.

Abstract: A heatsink structure cools a first electronic chip and a second electronic chip that are positioned serially and in-line to one or more cooling fan, such that cooling air from the cooling fan(s) passes above the first electronic chip before passing above the second electronic chip. The heatsink structure includes a first heatsink and a second heatsink, which are identical to each other, and which fit adjacent to one another when a first heatsink is rotated 180 degrees relative to the second heatsink.

Abstract: Disclosed aspects relate to cooling electronics. A set of recirculation flaps is coupled with a cooling fan. At least one recirculation flap has a ferrous material. In various embodiments, the set of recirculation flaps is arranged in an open position in response to air pressure from the cooling fan, and is arranged in a closed position in response to substantially no air pressure from the cooling fan. A controller is coupled with the cooling fan. The controller indicates a set of indicated positions for the set of recirculation flaps based on a tachometer value. An electromagnet is connected with the controller to position the set of recirculation flaps in the set of indicated positions using the ferrous material. In various embodiments, the electromagnet engages the ferrous material to arrange the set of recirculation flaps in an open position.

Abstract: Disclosed aspects relate to cooling electronics. A set of recirculation flaps is coupled with a cooling fan. At least one recirculation flap has a ferrous material. In various embodiments, the set of recirculation flaps is arranged in an open position in response to air pressure from the cooling fan, and is arranged in a closed position in response to substantially no air pressure from the cooling fan. A controller is coupled with the cooling fan. The controller indicates a set of indicated positions for the set of recirculation flaps based on a tachometer value. An electromagnet is connected with the controller to position the set of recirculation flaps in the set of indicated positions using the ferrous material. In various embodiments, the electromagnet engages the ferrous material to arrange the set of recirculation flaps in an open position.

Abstract: A heat exchanger door and heat exchanger core optimization method are provided. The door resides at an air inlet or outlet side of an electronics rack, and includes an air-to-coolant heat exchanger with a heat exchanger core. The core includes a first coolant channel coupled to a coolant inlet manifold downstream from a second coolant channel, and the first channel has a shorter channel length than the second channel. Further, coolant channels of the core are coupled to provide counter-flow cooling of an airflow passing across the core. The core optimization method determines at least one combination of parameters that optimize for a particular application at least two performance metrics of the heat exchanger. This method includes obtaining performance metrics for boundary condition(s) of possible heat exchanger configurations with different variable parameters to determine a combination of parameters that optimize the performance metrics for the heat exchanger.

Abstract: A method of cooling a heat generating enclosure includes setting a speed of each fan in a first array of fans, wherein each fan in the first array of fans is a first size, is disclosed. The method further includes measuring a process variable. The method also includes calculating a cooling strategy based at least in part on the value of the process variable. The method further includes setting the speed of each fan in the first array of fans or the speed of each fan in a second array of fans, wherein the second array of fans is in series to the first array of fans and each fan in the second array of fans is a second size, and wherein the speed of each fan that is set in the first or second array is set to implement the cooling strategy.

Abstract: A system for cooling a heat generating enclosure includes a first array of one or more fans of a first size and a second array of one or more fans of a second size, where the second array is in series to the first array. The system also includes a measuring unit configured to measure at least one process variable. The system also includes a control unit configured to control at least one of the fans in the first array or at least one of the fans in the second array based on the process variable, wherein the fans are controlled to achieve an optimization criterion.

Abstract: An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.