Abstract: Packages and methods of assembly are described in which barriers are utilized during overmolding to improve volumetric efficiency. In one embodiment, a barrier includes multiple variable height components located on an interior of the barrier, where the barrier prevents the variable height components from being overmolded during the encapsulation process. In one embodiment, a barrier includes a camera module mounted on an image sensor located on an interior of the barrier, where the barrier prevents the camera module and image sensor from being overmolded during the encapsulation process. In an embodiment, a barrier is mounted on a secondary tier with the secondary tier mounted on a primary tier, where the barrier prevents multiple connector components located on an interior of the barrier from being overmolded during the encapsulation process.

Abstract: A camera module may be assembled from a base component formed of a horizontal surface and having a raised wall that extends vertically from the horizontal surface and a housing component having a vertical surface that affixes to, with adhesive, the raised wall of the base component. Assembly of the camera module may include dispensing adhesive along a top edge of the raised wall to partially overhang the edge and placing the housing component down onto the base component. During assembly, the adhesive that is distributed on the top surface of the raised wall can be sheared or otherwise distributed by the action of the a corresponding wall of the housing component moving to past the top surface and causes at least some of the adhesive to spread between opposing surfaces of respective vertical walls of the base component and the housing component of the camera. The adhesive is then cured.

Abstract: An image sensor device includes a substrate, a die, and an adhesive layer positioned between the substrate and the die. The substrate includes a first side having a curved surface. The die includes an image sensor component attached to the curved surface of the substrate. At least a portion of the die comprising the image sensor component has a curved surface. The adhesive layer positioned between the curved surface of the substrate and the die provides a fixed attachment between the die and the substrate.

Abstract: A camera module includes an image sensor, a flexible printed circuit with a first side affixed to a first side of the image sensor, a plurality of metallic leads affixed to a second side of the image sensor, and a lens assembly for directing light to the image sensor articulated to the image sensor by one or more of an overmolding attached to the leads and the flexible printed circuit. The first side of the image sensor is a side opposite the second side of the image sensor. The leads provide connection between the image sensor and leads in the flexible printed circuit.

Abstract: A tracking code is applied to a lens housing that holds one more lenses. A back focus distance and a tilt of an optical axis with respect to a datum of the lens housing is electronically recorded. A position of an image sensor surface of an image sensor mounted on a substrate is measured. The lens housing is positioned such that the optical axis is perpendicular to the image sensor surface using the measured position of the image sensor surface and the electronically recorded optical data for the lens housing. The lens housing is positioned along the optical axis such that the lenses are separated from the image sensor surface using the measured position of the image sensor surface and the electronically recorded back focus distance for the tracking code of the lens housing. The lens housing is joined to the substrate with an adhesive.

Abstract: A camera module includes an image sensor, a flexible printed circuit with a first side affixed to a first side of the image sensor, a plurality of metallic leads affixed to a second side of the image sensor, and a lens assembly for directing light to the image sensor articulated to the image sensor by one or more of an overmoulding attached to the leads and the flexible printed circuit. The first side of the image sensor is a side opposite the second side of the image sensor. The leads provide connection between the image sensor and leads in the flexible printed circuit.

Abstract: A method and clamping apparatus for securing a substrate within a substrate carrier during an ultrasonic mounting process. The clamping apparatus may include a substrate carrier having a top plate and a bottom plate, the top plate and the bottom plate forming a cavity dimensioned to hold a substrate. A clamping plate is positioned on a side of the top plate opposite the bottom plate, the clamping plate having an opening aligned with the cavity and a pair of clamping members, each of the pair of clamping members extending toward a center of the opening and through the cavity such that the clamping member presses portions of the substrate exposed through the opening against the bottom plate. The method may include providing a clamping plate having an opening configured for alignment with a cavity formed in a substrate carrier and mounting a pair of resilient arms to the clamping plate.

Abstract: An image sensor device includes a substrate, a die, and an adhesive layer positioned between the substrate and the die. The substrate includes a first side having a curved surface. The die includes an image sensor component attached to the curved surface of the substrate. At least a portion of the die comprising the image sensor component has a curved surface. The adhesive layer positioned between the curved surface of the substrate and the die provides a fixed attachment between the die and the substrate.

Abstract: A method and clamping apparatus for securing a substrate within a substrate carrier during an ultrasonic mounting process. The clamping apparatus may include a substrate carrier having a top plate and a bottom plate, the top plate and the bottom plate forming a cavity dimensioned to hold a substrate. A clamping plate is positioned on a side of the top plate opposite the bottom plate, the clamping plate having an opening aligned with the cavity and a pair of clamping members, each of the pair of clamping members extending toward a center of the opening and through the cavity such that the clamping member presses portions of the substrate exposed through the opening against the bottom plate. The method may include providing a clamping plate having an opening configured for alignment with a cavity formed in a substrate carrier and mounting a pair of resilient arms to the clamping plate.

Abstract: A carrier apparatus and method of assembling a carrier apparatus for processing a substrate. The carrier including a first carrier plate having a first plurality of cavities, each of the first plurality of cavities dimensioned to receive a first side of a substrate. The carrier further including a second carrier plate having a second plurality of cavities, each of the second plurality of cavities dimensioned to receive a second side of the substrate when the first carrier plate and the second carrier plate are placed in contact with one another. A magnet assembly is further provided which is configured to hold the first carrier plate and the second carrier plate together, the magnet assembly having at least one magnet positioned within a recess formed along one side of the first carrier plate or the second carrier plate.