Patents by Inventor Hsaio-Ping Chang

Hsaio-Ping Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050258536
    Abstract: An IC chip heat sink and method for dissipating heat from an integrated circuit (IC) chip, is disclosed. In a typical embodiment, the IC chip heat sink is fabricated by depositing a metal seed layer on the backside of a semiconductor wafer having multiple IC chips fabricated thereon. A photoresist layer is then deposited on the seed layer and patterned to define multiple photoresist openings. Multiple columns are formed on the seed layer by the electrochemical plating of a metal in the photoresist openings. Finally, the photoresist is stripped from the seed layer to define the multiple columns, which extend from the seed layer, and a network of heat sink channels between the columns. During functioning of the chip, heat is dissipated from the chip through the heat sink.
    Type: Application
    Filed: May 21, 2004
    Publication date: November 24, 2005
    Inventors: Kuo-Wei Lin, Hsaio-Ping Chang