Patents by Inventor Hsein-Pin Chen

Hsein-Pin Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7803425
    Abstract: A nanoporous film and fabrication method thereof. The method for fabricating nanoporous film comprising: providing a substrate with a surface; forming a coating of a composition on the surface, curing the coating to polymerize the oxide gel, thereby forming an organic/inorganic hybrid film; and dissolving the template from the organic/inorganic hybrid film by an organic solvent. Specifically, the composition comprises the following components: an oxide gel, a template and an initiator.
    Type: Grant
    Filed: August 29, 2005
    Date of Patent: September 28, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Wu-Jing Wang, Yen-Po Wang, Yun-Ching Lee, Joung-Yei Chen, Hsi-Hsin Shih, Hsein-Pin Chen
  • Publication number: 20060046045
    Abstract: A nanoporous film and fabrication method thereof. The nanoporous film according to the present invention has a plurality of nanopores distributed uniformly therein. Due to the nanopores, the nanoporous film has a refractive index less than 1.45, reducing the reflectivity of less than 3.0%. Furthermore, since the nanoporous film comprises organic-inorganic hybrid with a high crosslink density, the film exhibits superior mechanical strength and is highly suitable for use as anti-reflection and anti-abrasion coatings.
    Type: Application
    Filed: August 29, 2005
    Publication date: March 2, 2006
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wu-Jing Wang, Yen-Po Wang, Yun-Ching Lee, Joung-Yei Chen, Hsi-Hsin Shih, Hsein-Pin Chen
  • Publication number: 20040126538
    Abstract: A sheet (20) for use in microfluidic, microelectronic, micromechanical, and/or microoptical applications requiring through-flow, through-conductivity, through-transmission, and/or other through patterns. The sheet (20) includes micro-sized architecture including at least one via (22) extending through the thickness of the layer of thermoplastic material. The via-defining walls in the thermoplastic layer are formed by the thermoplastic material flowing around a projection and then solidifying around the projection.
    Type: Application
    Filed: January 17, 2003
    Publication date: July 1, 2004
    Inventors: Craig S. Corcoran, William J. Jaecklein, Robert M. Pricone, W. Scott Thielman, Cindy Chia-Wen Chiu, David Hsein-Pin Chen
  • Publication number: 20030155656
    Abstract: An anisotropically conductive structure for providing electrical interconnection between electronic components, and the process for making such anisotropically conductive structure. The anisotropically conductive structure includes a dielectric matrix having a substantially uniform thickness; an array of vias extending into or through the matrix; a plurality of conductive elements, wherein individual via contains at least one conductive element; a first adhesive layer adhered to the first major surface of the matrix; and optionally, a second adhesive layer adhered to the second major surface of the matrix.
    Type: Application
    Filed: January 17, 2003
    Publication date: August 21, 2003
    Inventors: Cindy Chia-Wen Chiu, David Hsein-Pin Chen, Philip Yi Zhi Chu, Hsiao Ken Chuang, H. Paul Barker