Abstract: A PCI-E bus standard compliant multifunctional interface board includes a substrate, a PCI-E connector, a storage device, a non-storage device and a signal dispatch device. The PCI-E connector is provided on the substrate and is configured to be electrically connected to a host. The storage device and the non-storage device are provided on the substrate. The signal dispatch device is provided on the substrate and includes: an upstream port, a downstream port and an I/O controller. The upstream port is electrically connected to the PCI-E connector. The downstream port is electrically connected to the storage device and/or the non-storage device. The I/O controller is electrically connected to the upstream port and the downstream port to control an electrical connection relationship between the host and the storage device and/or the non-storage device.

Abstract: Provided herein are compositions and methods of using prime editing systems comprising prime editors and prime editing guide RNAs for treatment of genetic disorders.

Abstract: The present invention provides a control method of an electronic device, wherein the control method includes the steps of: establishing pre-linked buffers in a memory; wirelessly receiving a frame; generating a plurality of MPDUs according to the frame, wherein each of the MPDUs comprises at least one MSDU; writing the MSDUs of the plurality of MPDUs into the pre-linked buffers, wherein each buffer is configured to store one MSDU; generating a command to read in-order MPDUs from the memory if the memory has the in-order MPDUs.

Abstract: Provided is a method for preventing or treating a liver disease, including administering a therapeutically effective amount of pharmaceutical composition to a subject in need, and the pharmaceutical composition includes the isothiocyanate structural modified compound and a pharmaceutically acceptable carrier thereof.

Abstract: A waveguide structure includes a substrate and a waveguide core coupled to the substrate and including a first material characterized by a first index of refraction and a first electro-optic coefficient. The waveguide structure also includes a first cladding layer at least partially surrounding the waveguide core and including a second material characterized by a second index of refraction less than the first index of refraction and a second electro-optic coefficient greater than the first electro-optic coefficient. The second cladding layer is coupled to the first cladding layer.

Abstract: An electronic device includes a flexible substrate and a conductive wire. The conductive wire is disposed on the flexible substrate and includes a metal portion and a plurality of openings disposed in the metal portion. The metal portion includes a plurality of extending portions and a plurality of joint portions, and each of the openings is surrounded by two of the plurality of extending portions and two of the plurality of joint portions. A ratio of a sum of widths of the plurality of extending portions to a sum of widths of the plurality of joint portions is in a range from 0.8 to 1.2.

Abstract: The present disclosure provides a method for preparing a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors, the composition prepared by the method, and use of the composition for treating arthritis. The composition of the present disclosure achieves the effect of treating arthritis through various efficacy experiments.

Abstract: A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.

Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.

Abstract: Manufacturing of a shoe or a portion of a shoe is enhanced by executing various shoe-manufacturing processes in an automated fashion. For example, information describing a shoe part may be determined, such as an identification, an orientation, a color, a surface topography, an alignment, a size, etc. Based on the information describing the shoe part, automated shoe-manufacturing apparatuses may be instructed to apply various shoe-manufacturing processes to the shoe part, such as a pickup and placement of the shoe part with a pickup tool.

Abstract: A signal control method suitable for a touch screen is provided. The signal control method comprises: switching a plurality of scan lines to an enabling voltage level sequentially in a display stage; turning on a plurality of switches sequentially to transmit a plurality of display data to a plurality of data lines when a first scan line of the plurality of scan lines is in an enabled voltage level, wherein a first switch of the plurality of switches is coupled to a first data line of the plurality of data lines, and the first data line corresponds to one of a plurality of dummy lines in a vertical direction, when the first scan line is in the enabled voltage level, the first switch is turned on after other switches are turned on; and setting the plurality of dummy lines to a touch voltage in a touch stage.

Abstract: An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.

Abstract: An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.

Abstract: An electronic package, a packaging substrate, and methods for fabricating the same are disposed. The electronic package includes a circuit structure having a first side and a second side opposing the first side, an electronic component disposed on the first side of the circuit structure, an encapsulation layer formed on the first side of the circuit structure and encapsulating the electronic component, a metal structure disposed on the second side of the circuit structure, and a plurality of conductive elements disposed on the metal structure. The plurality of conductive elements are disposed on the metal structure, rather than disposed on the circuit structure directly. Therefore, the bonding between the conductive elements and the circuit structure is improved, to avoid the plurality of conductive elements from being peeled.

Abstract: An electronic package and a method for manufacturing the electronic package are provided. The method includes forming a slope surface on at least one side surface of at least one of a plurality of electronic components, and then disposing the plurality of electronic components on a carrier structure, such that the two adjacent electronic components form a space by the slope surface. Afterwards, an encapsulation layer is formed on the carrier structure and filled into the space to cover the two adjacent electronic components so as to disperse stress on the electronic components through the design of the space to prevent cracking due to stress concentration.

Abstract: An electronic package and a method for manufacturing the electronic package are provided. The method includes forming a slope surface on at least one side surface of at least one of a plurality of electronic components, and then disposing the plurality of electronic components on a carrier structure, such that the two adjacent electronic components form a space by the slope surface. Afterwards, an encapsulation layer is formed on the carrier structure and filled into the space to cover the two adjacent electronic components so as to disperse stress on the electronic components through the design of the space to prevent cracking due to stress concentration.

Abstract: An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.

Abstract: A multi-layer circuit structure is disposed on the delivery loading plate through the bottom-layer circuit structure, the delivery loading plate exposes the conductive corrosion-barrier layer, and the top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. Therefore, before the multi-layer circuit board is delivered to the assembly company or before the multi-layer circuit board is packaged with chips, an electrical testing can be applied to the multi-layer circuit board.