Abstract: A computing system includes a chassis and a cage. The chassis includes one or more locking hooks. The cage includes a handlebar, a bar-linkage assembly, and a crank coupled to both the handlebar and the bar-linkage assembly. Rotating the handlebar from an unlocked position to a locked position lowers the cage relative to the chassis until the cage is locked in the one or more locking hooks of the chassis.

Abstract: Embodiments of the disclosure are directed to a cabinet for storing server equipment. The cabinet includes a fan cover disposed over the cabinet and configured to secure a plurality of fan units, and a locking system for securing the fan cover. The fan cover has a channel disposed along a front edge of the fan cover. The locking system includes at least one T-bar and a bracket. The at least one T-bar includes a horizontal bar movably disposed within the channel, and a vertical bar extending generally perpendicularly to the horizontal bar from a first end of the vertical bar. The bracket is coupled to a second end of the vertical bar. The bracket has a knob attached thereto for locking and unlocking the horizontal bar at a first position that locks the fan cover and a second position that unlocks the fan cover.

Abstract: A computing system includes a chassis and a cage. The chassis includes one or more locking hooks. The cage includes a handlebar, a bar-linkage assembly, and a crank coupled to both the handlebar and the bar-linkage assembly. Rotating the handlebar from an unlocked position to a locked position lowers the cage relative to the chassis until the cage is locked in the one or more locking hooks of the chassis.

Abstract: Described herein are example riser modules for holding electrical components such as PCIe cards. The riser modules include a riser bracket and an opening to an interior space of the riser bracket. The riser modules also include an air duct movably coupled to the riser bracket. The air duct is movable between a plurality of positions relative to the riser bracket. The plurality of positions including at least an open position and a closed position.

Abstract: Described herein are example riser modules for holding electrical components such as PCIe cards. The riser modules include a riser bracket and an opening to an interior space of the riser bracket. The riser modules also include an air duct movably coupled to the riser bracket. The air duct is movable between a plurality of positions relative to the riser bracket. The plurality of positions including at least an open position and a closed position.

Abstract: An electronic device including a main body, a shell and a locking mechanism is provided. The locking mechanism includes a first locking component and at least one second locking component. The first locking component is slidably disposed at the main body, locks the shell and has at least one retaining portion. The second locking component is slidably disposed at the main body and locks the shell. The retaining portion blocks the second locking component from sliding relatively to the main body. When the first locking component slides relatively to the main body to release the shell, the retaining portion moves away from the second locking component and the second locking component slides relatively to the main body to release the shell.

Abstract: An electronic device including a main body, a shell and a locking mechanism is provided. The locking mechanism includes a first locking component and at least one second locking component. The first locking component is slidably disposed at the main body, locks the shell and has at least one retaining portion. The second locking component is slidably disposed at the main body and locks the shell. The retaining portion blocks the second locking component from sliding relatively to the main body. When the first locking component slides relatively to the main body to release the shell, the retaining portion moves away from the second locking component and the second locking component slides relatively to the main body to release the shell.

Abstract: A heat-dissipation module for a chip is disclosed. The heat-dissipation module includes a base having plural fastening holes, an edge, and a contacting surface attached to the chip, a conductive piece connected to the surface of the base and extended from the surface for heat-conducting, a fan set disposed by the edge of the base and connected to the conductive piece for cooling the conductive piece, and plural buffers disposed with respect to the plural fastening holes of the base for providing a cushioning force to facilitate the heat-dissipation module to be assembled.