Abstract: A method for preparing a modular planar interconnect plate includes steps of a) providing a metal blank sheet having a main region and two first lateral regions, b) forming two openings respectively in the first lateral regions, and c) stamping to form protrusions and depressions at the main region on lower and upper surfaces of the metal blank sheet. In the stamping step, each of two lower surrounding protrusions and two upper surrounding depressions is formed to surround a corresponding one of the openings, and each of an upper surrounding protrusion and a lower surrounding depression is formed to surround the first lateral regions and the corresponding ones of the protrusions and depressions formed at the main region.

Abstract: A planar solid electrolyte oxygen separator includes a first end plate formed with an oxygen outlet, a second end plate, two solid electrolyte cells disposed between the first and second end plates, and a planar interconnector disposed between the solid electrolyte cells. Each of the solid electrolyte cells includes two electrode layers, a metal-oxide-based electrolyte layer, and a through hole that is aligned with the oxygen outlet. The planar interconnector includes an upper portion having upper main channels and an upper passage, a lower portion having lower channels, and a connecting passage fluidly connected to the upper passage and the lower channels.

Abstract: A method for preparing a modular planar interconnect plate includes steps of a) providing a metal blank sheet having a main region and two first lateral regions, b) forming two openings respectively in the first lateral regions, and c) stamping to form protrusions and depressions at the main region on lower and upper surfaces of the metal blank sheet. In the stamping step, each of two lower surrounding protrusions and two upper surrounding depressions is formed to surround a corresponding one of the openings, and each of an upper surrounding protrusion and a lower surrounding depression is formed to surround the corresponding ones of the protrusions and depressions formed at the main region and the first lateral regions.

Abstract: A method for preparing a modular planar interconnect plate for a solid oxide fuel cell includes the steps of: (a) providing a metal blank sheet, (b) stamping a main region of the metal blank sheet to form a plurality of columns of upper protrusions on an upper surface of the main region of the metal blank sheet and a plurality of columns of lower depressions on a lower surface of the main region of the metal blank sheet, and (c) stamping the main region of the metal blank sheet to form a plurality of rows of lower protrusions on a lower surface of the main region of the metal blank sheet and a plurality of rows of upper depressions on the upper surface of the main region of the metal blank sheet.

Abstract: A method for preparing a modular planar interconnect plate for a solid oxide fuel cell includes the steps of: (a) providing a metal blank sheet, (b) stamping a main region of the metal blank sheet to form a plurality of columns of upper protrusions on an upper surface of the main region of the metal blank sheet and a plurality of columns of lower depressions on a lower surface of the main region of the metal blank sheet, and (c) stamping the main region of the metal blank sheet to form a plurality of rows of lower protrusions on a lower surface of the main region of the metal blank sheet and a plurality of rows of upper depressions on the upper surface of the main region of the metal blank sheet.

Abstract: A method for preparing a modular planar interconnect plate for a solid oxide fuel cell includes the steps of: (a) providing a metal blank sheet, (b) stamping a main region of the metal blank sheet to form a plurality of columns of upper protrusions on an upper surface of the main region of the metal blank sheet and a plurality of columns of lower depressions on a lower surface of the main region of the metal blank sheet, and (c) stamping the main region of the metal blank sheet to forma plurality of rows of lower protrusions on a lower surface of the main region of the metal blank sheet and a plurality of rows of upper depressions on the upper surface of the main region of the metal blank sheet.

Abstract: A method for preparing a modular planar interconnect plate for a solid oxide fuel cell includes the steps of: (a) providing a metal blank sheet, (b) stamping a main region of the metal blank sheet to form a plurality of columns of upper protrusions on an upper surface of the main region of the metal blank sheet and a plurality of columns of lower depressions on a lower surface of the main region of the metal blank sheet, and (c) stamping the main region of the metal blank sheet to forma plurality of rows of lower protrusions on a lower surface of the main region of the metal blank sheet and a plurality of rows of upper depressions on the upper surface of the main region of the metal blank sheet.

Abstract: A modular planar interconnect device for a solid oxide fuel cell includes a planar interconnect body, a pair of upper shielding plates, and a pair of lower shielding plates. The upper shielding plates are configured to be respectively fitted between front and rear boundary wall surfaces of a first inlet region of the planar interconnect body and between front and rear boundary wall surfaces of a first outlet region of the planar interconnect body. The lower shielding plates are configured to be respectively fitted between right and left boundary wall surfaces of a second inlet region of the planar interconnect body and between right and left boundary wall surfaces of a second outlet region of the planar interconnect body.

Abstract: A modular planar interconnect device for a solid oxide fuel cell includes a planar interconnect body, a pair of upper shielding plates, and a pair of lower shielding plates. The upper shielding plates are configured to be respectively fitted between front and rear boundary wall surfaces of a first inlet region of the planar interconnect body and between front and rear boundary wall surfaces of a first outlet region of the planar interconnect body. The lower shielding plates are configured to be respectively fitted between right and left boundary wall surfaces of a second inlet region of the planar interconnect body and between right and left boundary wall surfaces of a second outlet region of the planar interconnect body.

Abstract: A modular planar interconnect device for a solid oxide fuel cell includes a planar interconnect body, a pair of upper shielding plates, and a pair of lower shielding plates. The planar interconnect body includes a right lateral surface and a left lateral surface. The right lateral surface includes a right lateral slot to fluidly communicate with an introducing slot of the planar interconnect body. The left lateral surface includes a left lateral slot to fluidly communicate with an exit slot of the planar interconnect body.

Abstract: A modular planar interconnect device for a solid oxide fuel cell includes a planar interconnect body, a pair of upper shielding plates, and a pair of lower shielding plates. The planar interconnect body includes a right lateral surface and a left lateral surface. The right lateral surface includes a right lateral slot to fluidly communicate with an introducing slot of the planar interconnect body. The left lateral surface includes a left lateral slot to fluidly communicate with an exit slot of the planar interconnect body.

Abstract: A modular planar interconnect device for a solid oxide fuel cell includes a planar interconnect body, a pair of upper shielding plates, and a pair of lower shielding plates. The upper shielding plates are configured to be respectively fitted between front and rear boundary wall surfaces of a first inlet region of the planar interconnect body and between front and rear boundary wall surfaces of a first outlet region of the planar interconnect body. The lower shielding plates are configured to be respectively fitted between right and left boundary wall surfaces of a second inlet region of the planar interconnect body and between right and left boundary wall surfaces of a second outlet region of the planar interconnect body.

Abstract: A modular planar interconnect device for a solid oxide fuel cell includes a planar interconnect body, a pair of upper shielding plates, and a pair of lower shielding plates. The upper shielding plates are configured to be respectively fitted between front and rear boundary wall surfaces of a first inlet region of the planar interconnect body and between front and rear boundary wall surfaces of a first outlet region of the planar interconnect body. The lower shielding plates are configured to be respectively fitted between right and left boundary wall surfaces of a second inlet region of the planar interconnect body and between right and left boundary wall surfaces of a second outlet region of the planar interconnect body.

Abstract: A ceramic cell structure includes an upper electrode layer, and a lower electrode layer. At least one electrolyte layer and at least one electron barrier layer are disposed between the upper electrode layer and the lower electrode layer. By changing the combination of the electrolyte layer and the, electron barrier layer disposed between the upper electrode layer and the lower electrode layer, the problem caused by conducting electricity via the electron which results in open circuit voltage drop and high temperature due to solely using electrolyte laser can be avoided. Conducting electricity via the electron can be prevented by adding the electron barrier layer with high ionic conductivity ratio. Besides, the ceramic cell can further increase the open circuit voltage and the power density above 700° C.

Abstract: A thermally conductive silicone composition includes 25 to 50 volume % of a silicone, 30 to 60 volume % of a first heat conducting filler, and 20 to 40 volume % of a second heat conducting filler, and 1 to 2 volume % of a third heat conducting filler. The thermally conductive silicone composition has two heat conducting fillers with different sizes dispersed therein, thus the thermal impedance can be efficiently reduced.

Abstract: A thermally conductive silicone composition includes 25 to 50 volume % of a silicone, 30 to 60 volume % of a first heat conducting filler, and 20 to 40 volume % of a second heat conducting filler, and 1 to 2 volume % of a third heat conducting filler. The thermally conductive silicone composition has two heat conducting fillers with different sizes dispersed therein, thus the thermal impedance can be efficiently reduced.

Abstract: A thermally conductive silicone composition includes 25 to 50 volume % of a silicone, 30 to 60 volume % of a first heat conducting filler, and 15 to 40 volume % of a second heat conducting filler. The thermally conductive silicone composition has two heat conducting fillers with different sizes dispersed therein, thus the thermal impedance can be efficiently reduced.