Patents by Inventor Hsi-Chuan Tsai

Hsi-Chuan Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5591814
    Abstract: A curing agent for epoxy resins is prepared from an amine and an epoxy, as well as subsequent modification by a polyisocyanate compound, in such a manner that the curing agent is in the form of small spherical particles. The particles can be as small as 0.1 microns. This curing agent can be easily dispersed in curing agent masterbatches and curable compositions with minimal effect on their storage stability. The resulting curable compositions have a wide range of applications, including automobile and electronic adhesives.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: January 7, 1997
    Assignee: W. R. Grace & Co.-Conn.
    Inventors: Souichi Muroi, Hsi-Chuan Tsai
  • Patent number: 5567792
    Abstract: A curing agent for epoxy resins is prepared from an amine and an epoxy, as well as subsequent modification by a polyisocyanate compound, in such a manner that the curing agent is in the form of small spherical particles. The particles can be as small as 0.1 microns. This curing agent can be easily dispersed in curing agent masterbatches and curable compositions with minimal effect on their storage stability. The resulting curable compositions have a wide range of applications, including automobile and electronic adhesives.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: October 22, 1996
    Assignee: W. R. Grace & Co.-Conn.
    Inventors: Souichi Muroi, Hsi-Chuan Tsai
  • Patent number: 5561204
    Abstract: A curing agent for epoxy resins is prepared from an amine and an epoxy, as well as subsequent modification by a polyisocyanate compound, in such a manner that the curing agent is in the form of small spherical particles. The particles can be as small as 0.1 microns. This curing agent can be easily dispersed in curing agent masterbatches and curable compositions with minimal effect on their storage stability. The resulting curable compositions have a wide range of applications, including automobile and electronic adhesives.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: October 1, 1996
    Assignee: W. R. Grace & Co.-Conn.
    Inventors: Souichi Muroi, Hsi-Chuan Tsai
  • Patent number: 5554714
    Abstract: A curing agent for epoxy resins is prepared from an amine and an epoxy, as well as subsequent modification by a polyisocyanate compound, in such a manner that the curing agent is in the form of small spherical particles. The particles can be as small as 0.1 microns. This curing agent can be easily dispersed in curing agent masterbatches and curable compositions with minimal effect on their storage stability. The resulting curable compositions have a wide range of applications, including automobile and electronic adhesives.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: September 10, 1996
    Assignee: W. R. Grace & Co.-Conn.
    Inventors: Souichi Muroi, Hsi-Chuan Tsai
  • Patent number: 5548058
    Abstract: A curing agent for epoxy resins is prepared from an amine and an epoxy, as well as subsequent modification by a polyisocyanate compound, in such a manner that the curing agent is in the form of small spherical particles. The particles can be as small as 0.1 microns. This curing agent can be easily dispersed in curing agent masterbatches and curable compositions with minimal effect on their storage stability. The resulting curable compositions have a wide range of applications, including automobile and electronic adhesives.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: August 20, 1996
    Assignee: W. R. Grace & Co.-Conn.
    Inventors: Souichi Muroi, Hsi-Chuan Tsai
  • Patent number: 5480957
    Abstract: A curing agent for epoxy resins is prepared from an amine and an epoxy, as well as subsequent modification by a polyisocyanate compound, in such a manner that the curing agent is in the form of small spherical particles. The particles can be as small as 0.1 microns. This curing agent can be easily dispersed in curing agent masterbatches and curable compositions with minimal effect on their storage stability. The resulting curable compositions have a wide range of applications, including automobile and electronic adhesives.
    Type: Grant
    Filed: February 18, 1993
    Date of Patent: January 2, 1996
    Assignee: W. R. Grace & Co.-Conn.
    Inventors: Souichi Muroi, Hsi-Chuan Tsai
  • Patent number: 5357008
    Abstract: A latent curing agent for epoxy resins in the form of finely divided particles is disclosed, along with its method of preparation. An amine/epoxy adduct is formed in small particles with an encapsulating layer of polyfunctional epoxy or isocyanate on the surface by an emulsion precipitation method.
    Type: Grant
    Filed: January 14, 1993
    Date of Patent: October 18, 1994
    Assignee: W. R. Grace & Co.-Conn.
    Inventors: Hsi-Chuan Tsai, Souichi Muroi