Abstract: A heat-dissipation module dissipating heat for a heat-generating element on circuit board and including a heat-transferring base, a base, a first heat-dissipation unit, a heat pipe and a second heat-dissipation unit is provided. One surface of the heat-transferring base contacts the heat-generating element. The base is connected to the other surface of the heat-transferring base and has a heat-transferring block. The first heat-dissipation unit has a first fin assembly provided on the base. The first heat pipe is embedded in the heat-transferring base, one end thereof passes through the first heat-dissipation unit, and the other end thereof passes through the heat-transferring block. The second heat-dissipation unit has a second fin assembly and a second heat pipe passing through the second fin assembly and actively connected to the heat-transferring block along a route. The second heat-dissipation unit is suitable to move relative to the first heat-dissipation unit along the route.

Abstract: A heat-dissipation module dissipating heat for a heat-generating element on circuit board and including a heat-transferring base, a base, a first heat-dissipation unit, a heat pipe and a second heat-dissipation unit is provided. One surface of the heat-transferring base contacts the heat-generating element. The base is connected to the other surface of the heat-transferring base and has a heat-transferring block. The first heat-dissipation unit has a first fin assembly provided on the base. The first heat pipe is embedded in the heat-transferring base, one end thereof passes through the first heat-dissipation unit, and the other end thereof passes through the heat-transferring block. The second heat-dissipation unit has a second fin assembly and a second heat pipe passing through the second fin assembly and actively connected to the heat-transferring block along a route. The second heat-dissipation unit is suitable to move relative to the first heat-dissipation unit along the route.

Abstract: An electronic device has a first circuit board, a first fan, a second circuit board, a first heat sink, and a first air ventilation duct. The first fan and the first circuit board are electrically connected together. The second circuit board is electrically connected to the first circuit board; the first heat sink is electrically connected to the second circuit board; and the first air ventilation duct is connected to the first fan and the first heat sink. The first heat sink introduce the heat generated by the electronic element on the second circuit board to the first fan for better cooling performance. Therefore, the present invention requires only the first fan and the second fan, but is able to provide high cooling efficiencies with a low noise signature.

Abstract: An electronic device includes a circuit board and a heat spreader. The circuit board has a first surface, a second surface, and an electronic component. The first surface is opposite to the second surface, and the electronic component is located on the first surface. The heat spreader is disposed on the circuit board has a first portion, a second portion, and a third portion. The first portion is located on the first surface of the circuit board and contacts the electronic component. The second portion is located on the second surface of the circuit board, and the third portion is connected between the first portion and the second portion.

Abstract: An electronic device has a first circuit board, a first fan, a second circuit board, a first heat sink, and a first air ventilation duct. The first fan and the first circuit board are electrically connected together. The second circuit board is electrically connected to the first circuit board; the first heat sink is electrically connected to the second circuit board; and the first air ventilation duct is connected to the first fan and the first heat sink. The first heat sink introduce the heat generated by the electronic element on the second circuit board to the first fan for better cooling performance. Therefore, the present invention requires only the first fan and the second fan, but is able to provide high cooling efficiencies with a low noise signature.