Patents by Inventor Hsi-Hsun Ho

Hsi-Hsun Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reinforced die pad support structure
    Patent number: 6921967
    Abstract: A semiconductor package comprising a die pad defining opposed top and bottom surfaces and a peripheral edge. Attached to the peripheral edge of the die pad is a plurality of support feet which extend downwardly relative to the bottom surface thereof. A plurality of leads extend at least partially about the peripheral edge of the die pad in spaced relation thereto. Attached to the top surface of the die pad is a semiconductor die which is electrically connected to at least one of the leads. A package body encapsulates the die pad, the support feet, the leads and the semiconductor die such that at least portions of the leads are exposed in the package body.
    Type: Grant
    Filed: September 24, 2003
    Date of Patent: July 26, 2005
    Assignee: Amkor Technology, Inc.
    Inventors: Chung-Hsing Tzu, Jun-Chun Shih, Kuang-Yang Chen, Kuo-Chang Tan, Hsi-Hsun Ho, June-Wen Liao, Ching-Huai Wang
  • REINFORCED DIE PAD SUPPORT STRUCTURE
    Publication number: 20050062139
    Abstract: A semiconductor package comprising a die pad defining opposed top and bottom surfaces and a peripheral edge. Attached to the peripheral edge of the die pad is a plurality of support feet which extend downwardly relative to the bottom surface thereof. A plurality of leads extend at least partially about the peripheral edge of the die pad in spaced relation thereto. Attached to the top surface of the die pad is a semiconductor die which is electrically connected to at least one of the leads. A package body encapsulates the die pad, the support feet, the leads and the semiconductor die such that at least portions of the leads are exposed in the package body.
    Type: Application
    Filed: September 24, 2003
    Publication date: March 24, 2005
    Inventors: Chung-Hsing Tzu, Jung-Chun Shih, Kuang-Yang Chen, Kuo-Chang Tan, Hsi-Hsun Ho, June-Wen Liao, Ching-Huai Wang