Patents by Inventor Hsi-Hung Chen
Hsi-Hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240147639Abstract: An electronic device includes a substrate, a side wiring, a protective film, and a first filler. The substrate has a first surface, a second surface, and a side surface connected between the first surface and the second surface. The side wiring is disposed on the substrate and extends from the first surface to the second surface through the side surface. The protective film is disposed on the side wiring. The side wiring is sandwiched between the substrate and the protective film. An edge of the protective film extends beyond a side wall of the side wiring, and the protective film, the side wall of the side wiring, and the substrate define a gap. The first filler is disposed on the protective film and in the gap, wherein the first filler includes a first material and a plurality of particles mixed within the first material.Type: ApplicationFiled: October 4, 2023Publication date: May 2, 2024Applicant: AUO CorporationInventors: Chih-Wen Lu, Fan-Yu Chen, Chun-Yueh Hou, Hsi-Hung Chen
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Patent number: 11963300Abstract: A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.Type: GrantFiled: July 9, 2021Date of Patent: April 16, 2024Assignee: Au Optronics CorporationInventors: Chun-Yueh Hou, Hao-An Chuang, Fan-Yu Chen, Hsi-Hung Chen, Yun Cheng, Wen-Chang Hsieh, Chih-Wen Lu
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Patent number: 11921260Abstract: A lens assembly includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens, wherein the first, second, third, fourth, fifth, and sixth lenses are arranged in order from an object side to an image side along an optical axis. The first lens is a meniscus lens with positive refractive power and includes a convex surface facing the object side and a concave surface facing the image side. The second, third, and fourth lenses are with refractive power. The fifth lens is with positive refractive power and includes a convex surface facing the image side. The sixth lens is with negative refractive power and includes a concave surface facing the image side. The lens assembly satisfies: 3<D1/T6<9; wherein D1 is an effective optical diameter of the convex surface of the first lens and T6 is a thickness of the sixth lens.Type: GrantFiled: August 23, 2019Date of Patent: March 5, 2024Assignees: SINTAI OPTICAL (SHENZHEN) CO., LTD., ASIA OPTICAL CO., INC.Inventors: Chien-Hung Chen, Hsi-Ling Chang
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Publication number: 20240072411Abstract: An electronic device includes a metal back cover, a metal frame, a first antenna module and a second antenna module. The metal frame includes a first and a second disconnection portion, a first and a second connection portion. The first and the second connection portion are connected to the metal back cover. The first disconnection portion is separated from the first connection portion, the metal back cover and the second disconnection portion to form a first slot. The second disconnection portion is connected to the second connection portion and is separated from the metal back cover to form a second slot. The first antenna module is connected to the first disconnection portion, and forms a first antenna path. The second antenna module is connected to the second disconnection portion, and forms a second and a third antenna path with the second disconnection portion and the metal back cover.Type: ApplicationFiled: July 28, 2023Publication date: February 29, 2024Applicant: Pegatron CorporationInventors: Chien-Yi Wu, Hau Yuen Tan, Chao-Hsu Wu, Chih-Wei Liao, Chia-Hung Chen, Chen-Kuang Wang, Wen-Hgin Chuang, Chia-Hong Chen, Hsi Yung Chen
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Patent number: 11533811Abstract: An electronic device includes a substrate, multiple side wires, and a protection structure. The substrate has a first main surface, a side surface, and a first multi-turning surface connected between the first main surface and the side surface. The first multi-turning surface includes multiple first turning surfaces with differing normal directions. The side wires are disposed on the substrate. Each of the side wires extends from the first main surface over the first multi-turning surface to the side surface. The protection structure is disposed on the substrate and includes a wire protection part covering the side wires. The wire protection part has a first thickness at the side surface, a second thickness at the first main surface, and a third thickness at at least one of the first turning surfaces. The first thickness is greater than the second thickness, and the second thickness is greater than the third thickness.Type: GrantFiled: July 7, 2021Date of Patent: December 20, 2022Assignee: Au Optronics CorporationInventors: Yun Cheng, Hao-An Chuang, Hsi-Hung Chen, Chun-Yueh Hou, Fan-Yu Chen
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Publication number: 20220053638Abstract: A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.Type: ApplicationFiled: July 9, 2021Publication date: February 17, 2022Applicant: Au Optronics CorporationInventors: Chun-Yueh Hou, Hao-An Chuang, Fan-Yu Chen, Hsi-Hung Chen, Yun Cheng, Wen-Chang Hsieh, Chih-Wen Lu
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Publication number: 20220053646Abstract: An electronic device includes a substrate, multiple side wires, and a protection structure. The substrate has a first main surface, a side surface, and a first multi-turning surface connected between the first main surface and the side surface. The first multi-turning surface includes multiple first turning surfaces with differing normal directions. The side wires are disposed on the substrate. Each of the side wires extends from the first main surface over the first multi-turning surface to the side surface. The protection structure is disposed on the substrate and includes a wire protection part covering the side wires. The wire protection part has a first thickness at the side surface, a second thickness at the first main surface, and a third thickness at at least one of the first turning surfaces. The first thickness is greater than the second thickness, and the second thickness is greater than the third thickness.Type: ApplicationFiled: July 7, 2021Publication date: February 17, 2022Applicant: Au Optronics CorporationInventors: Yun Cheng, Hao-An Chuang, Hsi-Hung Chen, Chun-Yueh Hou, Fan-Yu Chen