Abstract: A die stacking method is provided. The die stacking method includes executing a manufacturing recipe, and loading an interposer-die mapping file according to the manufacturing recipe. The interposer-die mapping file corresponds to an interposer wafer including interposer dies. The die stacking method also includes loading a combination setting data according to the interposer-die mapping file, and loading a top die number and a top-die ID code of a top-die mapping file according to the combination setting data and the interposer-die mapping file. The top-die ID code corresponds to a top wafer including top dies, and the top die number corresponds to one of the top dies. The die stacking method also includes disposing the one of the top dies of the top wafer on one of the interposer dies of the interposer wafer.

Abstract: An ultraviolet water purifier includes a water filter including a water inlet connector for guiding in a fluid, a filter element for filtering the fluid from the water inlet connector and a filtered water outlet connector for guiding out the filtered fluid, a housing including an intake water connection portion for guiding in the filtered fluid, a purified water output portion and a water passage in communication between the intake water connection portion and the purified water output portion, a hydroelectric generator drivable by the flowing of the filtered fluid in the water passage to generate electricity and to provide generated electricity to a germicidal UV lamp for sterilizing the filtered fluid that flows out of the water passage through the purified water output portion.

Abstract: An energy management strategy for boats and ships is provided. The output and distribution of energy are dynamically adjusted in accordance with commands, tides, time, locations, weather, hydrologic conditions and other factors may impact the sailing, in order to optimize the energy efficiency of boats and ships.

Abstract: A detachable assembly including: a detachable frame including elongated opposing side portions; an assembly structure affixed to the detachable frame, the assembly structure and the detachable frame defining a detachable portion of the detachable assembly; a mounted elongated track assembly, the elongated track assembly having opposing tubular tracks having interior slots adapted to receive the elongated opposing tubular side portions of the detachable frame in a sliding relationship.

Abstract: An ice maker assembly is provided that includes a tray having a plurality of ice-phobic recesses. The recesses may possess a total water volume of 70 cc or greater. The tray comprises metal material and can be formed with a substantially uniform strain distribution. The ice maker further includes a frame body coupled to the tray, a driving body that is rotatably coupled to the ice-forming tray, and a processor that is operatively coupled to the driving body. The processor controls the driving body to rotate the tray in a manner that flexes the tray to dislodge ice pieces formed in the recesses.

Abstract: An ice making module for an appliance includes a conductive ice tray having an ice forming cavity. An electrical circuit is in electrical communication with the conductive ice tray and includes a power source in electrical communication with the conductive ice tray and a switch. The switch releases an electromagnetic pulse through the conductive ice tray. A water dispensing mechanism disposes water into the ice forming cavity and a cooling apparatus cools the water to form at least one ice piece that is in electromagnetic communication with the conductive ice tray. The electromagnetic pulse released through the conductive ice tray generates an induced electrical current through the ice piece and a repelling electromagnetic force between the conductive ice tray and the ice piece, wherein the repelling force biases the ice piece away from the conductive ice tray, thereby ejecting the ice piece from the ice forming cavity.

Abstract: An ice maker of a domestic refrigerator that includes an ice mold having an electrically-conductive polymeric body and a plurality of cavities defined in the polymeric body. Each cavity is sized to receive a quantity of fluid corresponding to a single ice cube. A pair of electrodes is engaged with a bottom surface of the polymeric body. The polymeric body has a first electrical conductivity at a first operating temperature and a second electrical conductivity that is less than the first electrical conductivity at a second operating temperature. The second operating temperature is greater than the first operating temperature.

Abstract: An ice maker is provided that includes a tray having recesses that can include ice-phobic surfaces. The ice-phobic surfaces may include ice-phobic coatings, textured metal surfaces, hydrophobic coatings or other surfaces configured to repel water and ice. The tray can be formed from metal material and may exhibit a fatigue limit greater than about 150 Megapascals (MPa) at 105 cycles. The ice maker further includes a frame body coupled to the tray, and a driving body that is rotatably coupled to the tray. The driving body is further adapted to rotate the tray in a clockwise and/or counter-clockwise cycle such that the tray presses against the frame body in a manner that flexes the tray to dislodge ice pieces formed in the recesses of the tray.

Abstract: An ice maker is provided that includes a tray having recesses that can include ice-phobic surfaces. The ice-phobic surfaces may include ice-phobic coatings, textured metal surfaces, hydrophobic coatings or other surfaces configured to repel water and ice. The tray can be formed from metal material and may exhibit a fatigue limit greater than about 150 Megapascals (MPa) at 105 cycles. The ice maker further includes a frame body coupled to the tray, and a driving body that is rotatably coupled to the tray. The driving body is further adapted to rotate the tray in a clockwise and/or counter-clockwise cycle such that the tray presses against the frame body in a manner that flexes the tray to dislodge ice pieces formed in the recesses of the tray.

Abstract: Embodiments of a die stacking apparatus are provided. The die stacking apparatus includes a storage device configured to contain a top wafer and an interposer wafer. The top wafer has a number of top dies, and the interposer wafer has a number of interposer dies. The die stacking apparatus also includes a carrier device configured to carry the interposer wafer, and a transferring device configured to transfer the interposer wafer to the carrier device and to dispose the top dies on the interposer dies. The die stacking apparatus further includes a process module configured to control the transferring device. The process module controls the transferring device to transfer the interposer wafer to the carrier device, and controls the transferring device to dispose the top dies on the interposer dies of the interposer wafer, which is stacked on the carrier device.

Abstract: A fingerprint sensor chip package structure including a circuit carrier and a fingerprint sensor chip is provided. The fingerprint sensor chip is disposed on the circuit carrier. The fingerprint sensor chip includes a chip body and a plurality of sensing structures. The chip body has an active surface, a fingerprint sensing back surface, a plurality of bond pads disposed on the active surface and a plurality of through holes. The chip body is electrically connected to the circuit carrier with the active surface facing the circuit carrier. The sensing structures are disposed in the through holes respectively. Each of the sensing structures includes a first dielectric layer, a first metal layer, a second dielectric layer and a second metal layer. The first dielectric layer is exposed on the fingerprint sensing back surface. The second metal layer extends to the active surface to be electrically connected to the corresponding bond pad.

Abstract: An air baffle for directing air within an information handling system is disclosed. The air baffle includes an open region configured to permit passage of an airflow, a closed region configured to obstruct passage of the airflow, and a variable region between the open region and the closed region. The air baffle further includes an adjustable tab configured to obstruct passage of the airflow. The variable region is configured to permit and obstruct passage of the airflow based on a position of the adjustable tab with respect to the variable region.

Abstract: An ice maker is provided that includes a tray having recesses that can include ice-phobic surfaces. The ice-phobic surfaces may include ice-phobic coatings, textured metal surfaces, hydrophobic coatings or other surfaces configured to repel water and ice. The tray can be formed from metal material and may exhibit a fatigue limit greater than about 150 Megapascals (MPa) at 105 cycles. The ice maker further includes a frame body coupled to the tray, and a driving body that is rotatably coupled to the tray. The driving body is further adapted to rotate the tray in a clockwise and/or counter-clockwise cycle such that the tray presses against the frame body in a manner that flexes the tray to dislodge ice pieces formed in the recesses of the tray.

Abstract: A detachable assembly including: a detachable frame including elongated opposing side portions; an assembly structure affixed to the detachable frame, the assembly structure and the detachable frame defining a detachable portion of the detachable assembly; a mounted elongated track assembly, the elongated track assembly having opposing tubular tracks having interior slots adapted to receive the elongated opposing tubular side portions of the detachable frame in a sliding relationship.

Abstract: An ice maker is provided that includes a tray having recesses that can include ice-phobic surfaces. The ice-phobic surfaces may include ice-phobic coatings, textured metal surfaces, hydrophobic coatings or other surfaces configured to repel water and ice. The tray can be formed from metal material and may exhibit a fatigue limit greater than about 150 Megapascals (MPa) at 105 cycles. The ice maker further includes a frame body coupled to the tray, and a driving body that is rotatably coupled to the tray. The driving body is further adapted to rotate the tray in a clockwise and/or counter-clockwise cycle such that the tray presses against the frame body in a manner that flexes the tray to dislodge ice pieces formed in the recesses of the tray.

Abstract: A light-emitting heat-dissipating device includes a base, a light-emitting annular set, a fan and a cover. The base has an annular frame and a pivotal connection portion. The light-emitting annular set is annularly disposed at the annular frame of the base. The fan is pivotally disposed at a pivotal connection portion of the base. The cover is disposed on the annular frame of the base. The light-emitting annular set is annularly disposed between the cover and the base such that the light-emitting annular ring is not subjected to any external force or weight and thereby not predisposed to damage. The light-emitting annular set enables a halo with uniformly-distributed brightness to be formed above the light-emitting heat-dissipating device.

Abstract: A method for fabricating a stacked electronic device is provided. A first three-dimensional (3D) printing is performed to form a first insulating layer and a plurality of first redistribution layers (RDLs) on a first substrate. A second 3D printing is performed to form a second substrate and a plurality of through-substrate vias (TSVs) on the first insulating layer, in which the plurality of TSVs is electrically connected to the plurality of first RDLs. A third 3D printing is performed to form a second insulating layer and a plurality of second RDLs on the second substrate, in which the plurality of second RDLs is electrically connected to the plurality of TSVs. A plurality of contacts of a third substrate is bonded to the plurality of second RDLs, so that the substrate is mounted onto the second insulating layer. The disclosure also provides a stacked electronic device formed by such a method.

Abstract: A method for fabricating a stacked package device is provided. A second substrate is adhered onto a first substrate. The first substrate includes a plurality of first bonding pads, and the second substrate includes a plurality of second bonding pads. A three-dimensional (3D) printing is performed to form an encapsulating layer covering the first substrate and the second substrate and to form a plurality of bonding wires in the encapsulating layer. Each bonding wire includes a first portion connected to one of the plurality of first bonding pads. The disclosure also provides a stacked package device formed by such a method.