Patents by Inventor Hsi-Shan Kuo
Hsi-Shan Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8890336Abstract: A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive cylinder and a solder block. The conductive cylinder is formed over the bonding pad of the silicon chip and the solder block is attached to the upper end of the conductive cylinder. The solder block has a melting point lower than the conductive cylinder. The solder block can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive cylinders and finally a solder block is attached to the end of each conductive cylinder.Type: GrantFiled: June 4, 2008Date of Patent: November 18, 2014Assignee: Qualcomm IncorporatedInventors: Jin-Yuan Lee, Chien-Kang Chou, Shih-Hsiung Lin, Hsi-Shan Kuo
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Patent number: 8461679Abstract: A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive pillar and a solder cap. The conductive pillar is formed over the bonding pad of the silicon chip and the solder cap is attached to the upper end of the conductive pillar. The solder cap has a melting point lower than the conductive pillar. The solder cap can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive pillars and finally a solder cap is attached to the end of each conductive pillar.Type: GrantFiled: May 16, 2011Date of Patent: June 11, 2013Assignee: Megica CorporationInventors: Jin-Yuan Lee, Chien-Kang Chou, Shih-Hsiung Lin, Hsi-Shan Kuo
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Publication number: 20110215476Abstract: A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive pillar and a solder cap. The conductive pillar is formed over the bonding pad of the silicon chip and the solder cap is attached to the upper end of the conductive pillar. The solder cap has a melting point lower than the conductive pillar. The solder cap can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive pillars and finally a solder cap is attached to the end of each conductive pillar.Type: ApplicationFiled: May 16, 2011Publication date: September 8, 2011Applicant: Megica CorporationInventors: Jin-Yuan Lee, Chien-Kang Chou, Shih-Hsiung Lin, Hsi-Shan Kuo
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Patent number: 7960270Abstract: A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive pillar and a solder cap. The conductive pillar is formed over the bonding pad of the silicon chip and the solder cap is attached to the upper end of the conductive pillar. The solder cap has a melting point lower than the conductive pillar. The solder cap can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive pillars and finally a solder cap is attached to the end of each conductive pillar.Type: GrantFiled: March 13, 2007Date of Patent: June 14, 2011Assignee: Megica CorporationInventors: Jin-Yuan Lee, Chien-Kang Chou, Shih-Hsiung Lin, Hsi-Shan Kuo
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Publication number: 20080296761Abstract: A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive cylinder and a solder block. The conductive cylinder is formed over the bonding pad of the silicon chip and the solder block is attached to the upper end of the conductive cylinder. The solder block has a melting point lower than the conductive cylinder. The solder block can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive cylinders and finally a solder block is attached to the end of each conductive cylinder.Type: ApplicationFiled: June 4, 2008Publication date: December 4, 2008Applicant: MEGICA CORPORATIONInventors: Jin-Yuan Lee, Chien-Kang Chou, Shih-Hsiung Lin, Hsi-Shan Kuo
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Publication number: 20070166993Abstract: A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive pillar and a solder cap. The conductive pillar is formed over the bonding pad of the silicon chip and the solder cap is attached to the upper end of the conductive pillar. The solder cap has a melting point lower than the conductive pillar. The solder cap can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive pillars and finally a solder cap is attached to the end of each conductive pillar.Type: ApplicationFiled: March 13, 2007Publication date: July 19, 2007Applicant: MEGICA CORPORATIONInventors: Jin-Yuan Lee, Chien-Kang Chou, Shih-Hsiung Lin, Hsi-Shan Kuo
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Patent number: 7208834Abstract: A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive pillar and a solder cap. The conductive pillar is formed over the bonding pad of the silicon chip and the solder cap is attached to the upper end of the conductive pillar. The solder cap has a melting point lower than the conductive pillar. The solder cap can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive pillars and finally a solder cap is attached to the end of each conductive pillar.Type: GrantFiled: June 22, 2004Date of Patent: April 24, 2007Assignee: Megica CorporationInventors: Jin-Yuan Lee, Chien-Kang Chou, Shih-Hsiung Lin, Hsi-Shan Kuo
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Publication number: 20050026413Abstract: A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive pillar and a solder cap. The conductive pillar is formed over the bonding pad of the silicon chip and the solder cap is attached to the upper end of the conductive pillar. The solder cap has a melting point lower than the conductive pillar. The solder cap can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive pillars and finally a solder cap is attached to the end of each conductive pillar.Type: ApplicationFiled: June 22, 2004Publication date: February 3, 2005Inventors: Jin-Yuan Lee, Chien-Kang Chou, Shih-Hsiung Lin, Hsi-Shan Kuo
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Patent number: 6784087Abstract: A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive cylinder and a solder block. The conductive cylinder is formed over the bonding pad of the silicon chip and the solder block is attached to the upper end of the conductive cylinder. The solder block has a melting point lower than the conductive cylinder. The solder block can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive cylinders and finally a solder block is attached to the end of each conductive cylinder.Type: GrantFiled: June 17, 2002Date of Patent: August 31, 2004Assignee: Megic CorporationInventors: Jin-Yuan Lee, Chien-Kang Chou, Shih-Hsiung Lin, Hsi-Shan Kuo
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Publication number: 20030148631Abstract: Within a method for forming a spin-on-glass (SOG) layer there is first provided a substrate. There is then formed over the substrate a spin-oil-glass (SOG) planarizing layer while employing a silsesquioxane spin-on-glass (SOG) planarizing material. There is then annealed thermally the spin-on-glass (SOG) planarizing layer while employing a first thermal annealing method employing a first gaseous atmosphere comprising a non-oxidizing gas to form a cured spin-on-glass (SOG) planarizing layer. Finally, there is then annealed thermally the cured spin-on-glass (SOG) planarizing layer while employing a second thermal annealing method employing a second gaseous atmosphere comprising an oxidizing gas to form firm the cured spin-on-glass (SOG) planarizing layer an oxidized cured spin-on-glass (SOG) planarizing layer.Type: ApplicationFiled: February 10, 2003Publication date: August 7, 2003Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANYInventors: Hsi-Shan Kuo, Wei-Kun Yeh
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Publication number: 20030129822Abstract: A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive cylinder and a solder block. The conductive cylinder is formed over the bonding pad of the silicon chip and the solder block is attached to the upper end of the conductive cylinder. The solder block has a melting point lower than the conductive cylinder. The solder block can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive cylinders and finally a solder block is attached to the end of each conductive cylinder.Type: ApplicationFiled: June 17, 2002Publication date: July 10, 2003Inventors: Jin-Yuan Lee, Chien-Kang Chou, Shih-Hsiung Lin, Hsi-Shan Kuo
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Publication number: 20030127734Abstract: A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylindrical bonding structure mainly includes a conductive cylinder and a solder block. The conductive cylinder is formed over the bonding pad of the silicon chip and the solder block is attached to the upper end of the conductive cylinder. The solder block has a melting point lower than the conductive cylinder. The solder block can be configured into a cylindrical, spherical or hemispherical shape. To fabricate the cylindrical bonding structure, a patterned mask layer having a plurality of openings that correspond in position to the bonding pads on the wafer is formed over a silicon wafer. Conductive material is deposited into the openings to form conductive cylinders and finally a solder block is attached to the end of each conductive cylinder.Type: ApplicationFiled: January 22, 2002Publication date: July 10, 2003Inventors: Jin-Yuan Lee, Chien-Kang Chou, Shih-Hsiung Lin, Hsi-Shan Kuo
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Patent number: 6032704Abstract: A method and apparatus for storing wafers without the moisture absorption problem by providing a wafer storage container that has a cavity therein and an inert gas supply line into the cavity for flowing an inert gas at a substantially constant flow rate into the cavity while allowing a portion of the inert gas to escape into surrounding environment outside the cavity such that there is always a positive pressure differential maintained between the cavity and the outside environment to keep out moisture.Type: GrantFiled: April 30, 1998Date of Patent: March 7, 2000Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Hsin-Chieh Huang, Yeh-Jye Wann, Hsi-Shan Kuo