Abstract: A light source module including a back frame, a light guide plate (LGP), and at least one light emitting device is provided. The back frame has a baseboard. The LGP is disposed on the back frame, and has a first surface, a second surface opposite to the first surface, and a light incident surface, wherein the second surface faces toward the baseboard. The light emitting device is disposed beside the light incident surface. The light source module further includes a thermal insulating element, which is disposed between the baseboard and the second surface, and is located adjacent to the light incident surface.

Abstract: A light source module including a back frame, a light guide plate (LGP), and at least one light emitting device is provided. The back frame has a baseboard. The LGP is disposed on the back frame, and has a first surface, a second surface opposite to the first surface, and a light incident surface, wherein the second surface faces toward the baseboard. The light emitting device is disposed beside the light incident surface. The light source module further includes a thermal insulating element, which is disposed between the baseboard and the second surface, and is located adjacent to the light incident surface.

Abstract: A light emitting diode (LED) package including a carrier, an LED chip, a first transparent encapsulant, a transparent cap, and a second transparent encapsulant is provided. The carrier has a carrying surface and a ring frame disposed on the carrying surface, and the ring frame forms an encapsulant-containing space on the carrying surface. The LED chip is disposed on the carrying surface and in the encapsulant-containing space. The LED chip is electrically connected to the carrier. The first transparent encapsulant fills the encapsulant-containing space to encapsulate the LED chip. The transparent cap is disposed on the carrier to cover the first transparent encapsulant and the ring frame. The second transparent encapsulant fills an interval between the first transparent encapsulant and the transparent cap.

Abstract: A light emitting diode (LED) package including a carrier, an LED chip, a first transparent encapsulant, a transparent cap, and a second transparent encapsulant is provided. The carrier has a carrying surface and a ring frame disposed on the carrying surface, and the ring frame forms an encapsulant-containing space on the carrying surface. The LED chip is disposed on the carrying surface and in the encapsulant-containing space. The LED chip is electrically connected to the carrier. The first transparent encapsulant fills the encapsulant-containing space to encapsulate the LED chip. The transparent cap is disposed on the carrier to cover the first transparent encapsulant and the ring frame. The second transparent encapsulant fills an interval between the first transparent encapsulant and the transparent cap.