Patents by Inventor Hsi-Song Kao

Hsi-Song Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Carbon-conductive ink resistor printed circuit board and its fabrication method
    Patent number: 6713399
    Abstract: A embedded resistor printed circuit board fabrication includes the steps of preparing a substrate having a top conductive layer and a bottom insulating layer and etching the top conductive layer to form a first conductive layer having recesses in it; embedding resistive material in the recesses, enabling the first conductive layer to be electrically connected to lateral sides of the resistive material; plating a thin conductive film on the first conductive layer and the resistive material to form a second conductive layer; and etching the first conductive layer and second conductive layer to let the second conductive layer be electrically connected to the thin film type resistors.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: March 30, 2004
    Assignee: Uni-Circuit Inc.
    Inventor: Hsi-Song Kao