Patents by Inventor HSI-TENG KAO

HSI-TENG KAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240058812
    Abstract: A bio chip package structure is provided, which includes a substrate having a top surface and a bottom surface, and a through hole penetrating the top surface and bottom surface of the substrate; a bio chip having an active surface and a back surface, at least two sides on the active surface of the bio chip having a plurality of I/O pads respectively, and a plurality of biological probes is arranged in area between the plurality of I/O pads, and the active surface of the bio chip is set toward to align the through hole of the substrate; and a mold is arranged on the top surface of the substrate, the mold having an opening to align with the through hole of the substrate, so the plurality of biological probes exposed from the through hole of the substrate and the opening of the mold.
    Type: Application
    Filed: July 20, 2023
    Publication date: February 22, 2024
    Inventor: HSI-TENG KAO
  • Publication number: 20240024876
    Abstract: The present invention disclosed a biological detection chip and its application thereof. The biological detection chip includes a plurality of transistors in parallel. Each of the transistors includes a substrate layer, a floating gate, an extending metal connector, an extending gate, and a biological detection layer. The biological detection chip is combined with biological probes after the surface modification process for biological detection. Biological detection includes Porcine Reproductive and Respiratory Syndrome Virus (PRRSV), Porcine Epidemic Diarrhea Virus (PEDV), and Cortisol detection.
    Type: Application
    Filed: July 19, 2023
    Publication date: January 25, 2024
    Inventors: Ming-Tang CHIOU, Wei-Hao LIN, Hsi-Teng KAO, Daisy CHENG, Shi-Wei LIN, Yi-Chan LEE
  • Publication number: 20220404345
    Abstract: A sensing chip with fluidic device includes a substrate with a first area and a second area, a field effect transistor is arranged in the second area of the substrate and is electrically connected with the field effect transistor. The fluidic device includes an insulation layer with a window to expose the surface of substrate in the second area. A second gate electrode is arranged in the window of the isolation layer on the second area of the substrate. The sample is placed in the fluidic device to contact with the second gate electrode, and the receptor(s) on the metal layer will capture the target object in the sample, so the voltage of the metal layer will change with amount of the target object captured by the receptor(s). Thus, the concentration of the target object(s) in the sample may obtain by the changes of the voltage of the metal layer.
    Type: Application
    Filed: June 21, 2022
    Publication date: December 22, 2022
    Inventor: HSI-TENG KAO
  • Publication number: 20220229012
    Abstract: A biological detecting chip and a biological detecting method are disclosed. The biological detecting chip includes a plurality of transistors in parallel. Each of the transistors includes a substrate layer, a floating gate, an extending gate and a biological detecting layer. The substrate layer includes a shared source, a shared drain and a channel area. The floating gate is disposed on the channel area. The floating gate includes a poly oxide layer to extend to an extending metal connect. The extending gate is disposed on the extending metal connect and is electrically connected to the floating gate. The biological detecting layer is disposed on the extending gate. The biological detecting layer includes a plurality of biological probes. The biological detecting layer of the transistors forms a plurality of biological detecting area on the surface of the biological detecting chip.
    Type: Application
    Filed: June 28, 2021
    Publication date: July 21, 2022
    Inventor: HSI-TENG KAO