Abstract: A MEM vibration sensor includes a substrate including a first supporting-portion and a cavity and a sensing-device disposed on the substrate. The sensing-device includes a second supporting-portion correspondingly disposed over and connected with the first supporting-portion, a first sensing-unit disposed on the cavity, a first mass-block disposed on the cavity, a second sensing-unit disposed on the first sensing-unit and the first mass-block, a first metal pad disposed on the third supporting-portion and electrically coupled with the first sensing-unit, and a second metal pad disposed on the third supporting-portion and electrically coupled with the second sensing-unit.

Abstract: A MEM vibration sensor includes a substrate and a sensing-device. The substrate includes a first supporting-portion and a cavity. The sensing-device includes a first sensing-unit, a second sensing-unit, a first metal pad and a second metal pad. The first sensing-unit includes a second supporting-portion and a vibrating-portion. The second supporting-portion is located on the first supporting-portion and is connected to the first supporting-portion via a first dielectric material. The vibrating-portion is located on the cavity, and is connected with the second supporting-portion through an elastic connecting-portion. The second sensing-unit is located on the first sensing-unit and includes a sensing-portion and a third supporting-portion. The sensing-portion is located on the vibrating-portion and has a gap with the vibrating-portion.

Abstract: A MEM vibration sensor includes a substrate including a first supporting-portion and a cavity and a sensing-device disposed on the substrate. The sensing-device includes a second supporting-portion correspondingly disposed over and connected with the first supporting-portion, a first sensing-unit disposed on the cavity, a first mass-block disposed on the cavity, a second sensing-unit disposed on the first sensing-unit and the first mass-block, a first metal pad disposed on the third supporting-portion and electrically coupled with the first sensing-unit, and a second metal pad disposed on the third supporting-portion and electrically coupled with the second sensing-unit.

Abstract: A force sensor includes a circuit board, a sensing element, and a first gel. The sensing element is disposed on the circuit board, wherein the sensing element has a top surface and a bottom surface opposite to each other and has a sensing portion. The bottom surface faces the circuit board. The sensing portion is located at the top surface. The first gel is disposed on the top surface and covers the sensing portion, wherein the sensing portion is adapted to generate a sensing signal through an external force transferred from the first gel to the top surface.

Abstract: A micro scanning mirror includes a lens, a piezoelectric material layer, two first rotating shaft elements, and first driving electrodes. A first axial direction passes through a center of the lens. The piezoelectric material layer is arranged along a circumferential direction of the lens and has first driving electrode regions. Each first spacing region where the piezoelectric material layer is not disposed is formed between two adjacent first driving electrode regions. Each first rotating shaft element is located between one of the first spacing regions and the corresponding adjacent first driving electrode region, and the first rotating shaft element connect the lens and the piezoelectric material layer located in the first driving electrode regions. The first driving electrodes are respectively located on the corresponding first driving electrode regions. The micro scanning mirror can obtain a large rotation angle of the mirror on the same driving condition and has good reliability.

Abstract: A force sensor includes a sensing element, a first circuit board, and at least one second circuit board. The sensing element has a top surface and the bottom surface opposite to each other and has a sensing portion, wherein the sensing portion is located at the top surface. The first circuit board is disposed on the top surface and is electrically connected to the sensing element. The at least one second circuit board is connected to the first circuit board, wherein the at least one second circuit board shields the sensing element. The sensing portion is adapted to generate a sensing signal through an external force transferred from the first circuit board to the top surface.

Abstract: A force sensor includes a sensing element, a first circuit board, and at least one second circuit board. The sensing element has a top surface and the bottom surface opposite to each other and has a sensing portion, wherein the sensing portion is located at the top surface. The first circuit board is disposed on the top surface and is electrically connected to the sensing element. The at least one second circuit board is connected to the first circuit board, wherein the at least one second circuit board shields the sensing element. The sensing portion is adapted to generate a sensing signal through an external force transferred from the first circuit board to the top surface.

Abstract: A force sensor includes a circuit board, a sensing element, and a first gel. The sensing element is disposed on the circuit board, wherein the sensing element has a top surface and a bottom surface opposite to each other and has a sensing portion. The bottom surface faces the circuit board. The sensing portion is located at the top surface. The first gel is disposed on the top surface and covers the sensing portion, wherein the sensing portion is adapted to generate a sensing signal through an external force transferred from the first gel to the top surface.

Abstract: A variable focal length optical element including a first substrate, at least one piezoelectric thin film, a reflection layer and multiple driving electrodes is provided. The first substrate has a first chamber. The at least one piezoelectric thin film is located on the first substrate. The reflection layer is located on a surface of the at least one piezoelectric thin film. The driving electrodes are located on the first substrate, and surround the first chamber. The at least one piezoelectric thin film is respectively driven by the corresponding driving electrodes, and each driving electrode respectively applies a driving voltage to the at least one piezoelectric thin film to deform the at least one piezoelectric thin film. The at least one piezoelectric thin film is adapted to effectively maintain optical quality of the variable focal length optical element under different environmental conditions, and avails improving reliability thereof.

Abstract: A force sensor including a sensing element and a circuit board is provided. The sensing element has a top surface and a bottom surface opposite to each other and has a sensing portion, wherein the sensing portion is located at the top surface. The circuit board is disposed above the top surface and electrically connected to the sensing element, wherein the sensing portion is adapted to generate a sensing signal through an external force transferred from the circuit board to the top surface.

Abstract: A force sensor including a sensing element and a circuit board is provided. The sensing element has a top surface and a bottom surface opposite to each other and has a sensing portion, wherein the sensing portion is located at the top surface. The circuit board is disposed above the top surface and electrically connected to the sensing element, Wherein the sensing portion is adapted to generate a sensing signal through an external force transferred from the circuit board to the top surface.

Abstract: A MEMS force sensor including a first substrate, a second substrate and a plurality of conductive terminals is provided. The second substrate is disposed opposite to the first substrate and includes a deformable portion and a force receiving portion. The deformable portion has a plurality of sensing elements. The force receiving portion protrudes from a surface of the deformable portion which is back facing to the first substrate, such that a cavity is formed above the deformable portion. The conductive terminals are electrically connected to the sensing elements, and the conductive terminals are centrally disposed under the cavity. The second substrate is fixed with the first substrate through the conductive terminals. A force sensing apparatus is also provided.

Abstract: A micro sensor including a first substrate and a second substrate is provided. The first substrate has a surface with a cavity. The second substrate has a sensing structure. The surface of the first substrate with the cavity is bonded to the second substrate to seal the cavity, such that a pressure value in the cavity is a constant value. A manufacturing method thereof is also provided.

Abstract: A solid tunable micro optical device for an micro-optical system is provided. The sold tunable micro optical device includes a first annular piece, a micro-lens with a spherical surface configured on the first annular piece, and a deforming device coupled to the first annular piece for deforming the micro-lens.

Abstract: A solid tunable micro optical device for an micro-optical system is provided. The sold tunable micro optical device includes a first annular piece, a micro-lens with a spherical surface configured on the first annular piece, and a deforming device coupled to the first annular piece for deforming the micro-lens.