Abstract: A light emitting device includes a base, a first light emitting unit, a second light emitting unit, a light conversion layer and a lens. The base has a first side slot, a second side slot, and a central slot separated from the first side slot and the second side slot, and the first side slot is formed in a separated recess configuration with a long axis and a short axis. The first light emitting unit is installed in the central slot, and the second light emitting unit is installed in the first side slot. The light conversion layer is covered onto the first light emitting unit or the second light emitting unit, and the lens covers the light conversion layer, the central slot, the first side slot, and the second side slot. The first slot and the lens have first similar contour lines in a top view.

Abstract: A light emitting device includes a base, a first light emitting unit, a second light emitting unit, a light conversion layer and a lens. The base has a first side slot, a second side slot, and a central slot separated from the first side slot and the second side slot, and the first side slot is formed in a separated recess configuration with a long axis and a short axis. The first light emitting unit is installed in the central slot, and the second light emitting unit is installed in the first side slot. The light conversion layer is covered onto the first light emitting unit or the second light emitting unit, and the lens covers the light conversion layer, the central slot, the first side slot, and the second side slot. The first slot and the lens have first similar contour lines in a top view.

Abstract: A light-emitting diode (LED) module and a method for operating the same are disclosed. The LED module is supplied through an external voltage source. The LED module includes a bridge rectifying unit, a LED unit, and an integrated circuit (IC) unit. The bridge rectifying unit rectifies the external voltage source into an inner DC voltage source. The LED unit is electrically connected to the bridge rectifying unit and driven through the DC voltage source. The IC unit is electrically connected to the bridge rectifying unit and the LED unit and is supplied through the DC voltage source, thus providing a piecewise constant-current control or a piecewise variant-current control to the LED unit.

Abstract: An illuminant device includes a housing, a circuit board, a plurality of LED dies, a light-transmitting layer, a controlling and driving module and a conductive connector. One end of the housing has a carrying part. The circuit board is disposed on the carrying part and has a circuit layer. The LED dies are placed on the circuit board and electrically connected to the circuit layer. The light-transmitting layer is circularly disposed on the circuit board and covering the LED dies. The controlling and driving module is placed on the circuit board and electrically connected to the circuit layer. The conductive connector is assembled with the other end of the housing and electrically connected to the circuit layer.

Abstract: An illuminant device includes a housing, a illuminant element, a resistor, and an over-temperature protective element. The housing includes an upper portion, a lower portion opposite to the upper portion, and two accommodating spaces, respectively formed in a first tubular configuration arranged between the upper end and the lower end and a second tubular configuration spatially isolated from the first accommodating space. The illuminant element is placed on the upper portion. The resistor is located within one of the accommodating space and electrically connected to the illuminant element. The over-temperature protective element is located within the other accommodating space and electrically connected to the illuminant element.

Abstract: An illuminant device includes a housing, a circuit board, a plurality of LED dies, a light-transmitting layer, a controlling and driving module and a conductive connector. One end of the housing has a carrying part. The circuit board is disposed on the carrying part and has a circuit layer. The LED dies are placed on the circuit board and electrically connected to the circuit layer. The light-transmitting layer is circularly disposed on the circuit board and covering the LED dies. The controlling and driving module is placed on the circuit board and electrically connected to the circuit layer. The conductive connector is assembled with the other end of the housing and electrically connected to the circuit layer.

Abstract: An illuminant device with over-temperature protection is electrically connected to a power source and includes a housing, a illuminant element, a resistor, and an over-temperature protective element. The housing includes an upper portion, a lower portion opposite to the upper portion, and two accommodating spaces communicating with the upper end and the lower end respectively. The illuminant element is placed on the upper portion. The resistor is located within one of the accommodating space and electrically connected to the illuminant element. The over-temperature protective element is located within the other accommodating space and electrically connected to the illuminant element. The over-temperature protective element senses temperatures of the illuminant element and selectively breaks the power source, such that the illuminant element is switched between conductive and non-conductive.

Abstract: A light emitting device includes a substrate, a plurality of rectifier diodes, and at least one light emitting diode (LED) module. The substrate has a first cavity, a second cavity, and a third cavity formed thereon. The rectifier diodes are arranged in the first cavity and the third cavity respectively. The LED module is arranged in the second cavity. The LED module includes a plurality of LEDs. The light emitting device is capable of rectifying and converting an alternating current (AC) power supply to drive the LEDs to emit light.

Abstract: An illuminant device includes a housing, a circuit board, a plurality of LED dies, a light-transmitting layer, a controlling and driving module and a conductive connector. One end of the housing has a carrying part. The circuit board is disposed on the carrying part and has a circuit layer. The LED dies are placed on the circuit board and electrically connected to the circuit layer. The light-transmitting layer is circularly disposed on the circuit board and covering the LED dies. The controlling and driving module is placed on the circuit board and electrically connected to the circuit layer. The conductive connector is assembled with the other end of the housing and electrically connected to the circuit layer.

Abstract: A Multi-Cavities light emitting device includes a base, a blue light emitting unit, at least two red light emitting units, a light conversion layer and a lens, and the base has a central slot and at least two side slots symmetrically formed on external sides of the central slot, and the blue light emitting unit is installed in the central slot, and the two red light emitting units are installed in the two side slots respectively, and the light conversion layer is covered onto the blue light emitting unit, and the lens is protruded from the base and sealed onto the central slot and at least two side slots, so as to achieve the effects of improving the light extraction efficiency of an LED chip and the yield rate of the product and reducing the overall assembling time and cost.

Abstract: A light emitting device comprises: a plurality of light emitting diodes and an insulating (low temperature co-fired ceramic) substrate with an array of recesses each for housing a respective one of the light emitting diodes. The substrate incorporates a pattern of electrical conductors that is configured for connecting the light emitting diodes in a selected electrical configuration and to provide at least two electrical connections on the floor of each recess. Light emitting diodes can be electrically connected to the electrical connections by at least one bond wire or by flip chip bonding. Each recess is filled with a transparent material to encapsulate each light emitting diode. The transparent material can incorporate at least one phosphor material such that the device emits light of a selected color and/or color temperature.

Abstract: A light emitting device comprises: an LED chip array comprising a plurality of LEDs formed on a single die (monolithic chip array) and at least one discrete LED that is separate from the LED chip array connected in series with the LED chip array. In an AC-drivable device the LED chip array is AC-drivable and two or more discrete LEDs are configured to be AC-drivable. The device can further comprise a package in which the LED chip array and discrete LED(s) are mounted. The discrete LEDs are configured such that positive and negative half wave periods of an AC drive voltage are mapped onto oppositely connected LED such that oppositely connected LED chips are alternately operable on a respective half wave period.

Abstract: A light emitting device comprises a plurality of LED chips (“lateral” or “vertical” conducting) operable to generate light of a first wavelength range and a package for housing the chips. The package comprises: a thermally conducting substrate (copper) on which the LED chips are mounted and a cover having a plurality of through-holes in which each hole corresponds to a respective one of the LED chips. The holes are configured such that when the cover is mounted to the substrate each hole in conjunction with the substrate defines a recess in which a respective chip is housed. Each recess is at least partially filled with a mixture of at least one phosphor material and a transparent material. In a device with “lateral” conducting LED chips a PCB is mounted on the substrate and includes a plurality of through-holes which are configured such that each chip is directly mounted to the substrate. For a device with “vertical” conducting LED chips the LED chips are mounted on a diamond like carbon film.

Abstract: A light-emitting diode (LED) module and a method for operating the same are disclosed. The LED module is supplied through an external voltage source. The LED module includes a bridge rectifying unit, a LED unit, and an integrated circuit (IC) unit. The bridge rectifying unit rectifies the external voltage source into an inner DC voltage source. The LED unit is electrically connected to the bridge rectifying unit and driven through the DC voltage source. The IC unit is electrically connected to the bridge rectifying unit and the LED unit and is supplied through the DC voltage source, thus providing a piecewise constant-current control or a piecewise variant-current control to the LED unit.

Abstract: A light emitting device includes a substrate, a plurality of rectifier diodes, and at least one light emitting diode (LED) module. The substrate has a first cavity, a second cavity, and a third cavity formed thereon. The rectifier diodes are arranged in the first cavity and the third cavity respectively. The LED module is arranged in the second cavity. The LED module includes a plurality of LEDs. The light emitting device is capable of rectifying and converting an alternating current (AC) power supply to drive the LEDs to emit light.

Abstract: A light emitting device includes a number of light emitting chips, a substrate to support the light emitting chips, a patterned first conductive layer over the substrate to facilitate radiation and reflection of light from the light emitting chips, and a patterned second conductive layer on the patterned first conductive layer, wherein the light emitting chips are located on the patterned second conductive layer.

Abstract: A light emitting device comprises: an LED chip array comprising a plurality of LEDs formed on a single die (monolithic chip array) and at least one discrete LED that is separate from the LED chip array connected in series with the LED chip array. In an AC-drivable device the LED chip array is AC-drivable and two or more discrete LEDs are configured to be AC-drivable. The device can further comprise a package in which the LED chip array and discrete LED(s) are mounted. The discrete LEDs are configured such that positive and negative half wave periods of an AC drive voltage are mapped onto oppositely connected LED such that oppositely connected LED chips are alternately operable on a respective half wave period.

Abstract: A light emitting device comprises a plurality of LED chips (“lateral” or “vertical” conducting) operable to generate light of a first wavelength range and a package for housing the chips. The package comprises: a thermally conducting substrate (copper) on which the LED chips are mounted and a cover having a plurality of through-holes in which each hole corresponds to a respective one of the LED chips. The holes are configured such that when the cover is mounted to the substrate each hole in conjunction with the substrate defines a recess in which a respective chip is housed. Each recess is at least partially filled with a mixture of at least one phosphor material and a transparent material. In a device with “lateral” conducting LED chips a PCB is mounted on the substrate and includes a plurality of through-holes which are configured such that each chip is directly mounted to the substrate. For a device with “vertical” conducting LED chips the LED chips are mounted on a diamond like carbon film.

Abstract: A light emitting device comprises: a plurality of light emitting diodes and an insulating (low temperature co-fired ceramic) substrate with an array of recesses each for housing a respective one of the light emitting diodes. The substrate incorporates a pattern of electrical conductors that is configured for connecting the light emitting diodes in a selected electrical configuration and to provide at least two electrical connections on the floor of each recess. Light emitting diodes can be electrically connected to the electrical connections by at least one bond wire or by flip chip bonding. Each recess is filled with a transparent material to encapsulate each light emitting diode. The transparent material can incorporate at least one phosphor material such that the device emits light of a selected color and/or color temperature.