Patents by Inventor Hsi-Yang Yeh

Hsi-Yang Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11252269
    Abstract: A mobile electronic device includes a main framework, back cover, expansion box, card reading module and battery module. The main framework has a motherboard. The back cover is disposed on the main framework and has an expansion window. The expansion box covers and closes the expansion window. The expansion box has therein an expansion chamber, a power chamber, and a communication opening whereby the expansion chamber and the power chamber communicate with each other. The expansion box has a wire connection opening in communication with the power chamber and with the expansion window. The card reading module and battery module are disposed in the expansion chamber and power chamber, respectively. The card reading module is connected to the motherboard by a signal wire via the communication opening and the wire connection opening. The battery module is connected to the motherboard by a power wire via the wire connection opening.
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: February 15, 2022
    Assignee: Getac Technology Corporation
    Inventor: Hsi-Yang Yeh
  • Publication number: 20210377373
    Abstract: A mobile electronic device includes a main framework, back cover, expansion box, card reading module and battery module. The main framework has a motherboard. The back cover is disposed on the main framework and has an expansion window. The expansion box covers and closes the expansion window. The expansion box has therein an expansion chamber, a power chamber, and a communication opening whereby the expansion chamber and the power chamber communicate with each other. The expansion box has a wire connection opening in communication with the power chamber and with the expansion window. The card reading module and battery module are disposed in the expansion chamber and power chamber, respectively. The card reading module is connected to the motherboard by a signal wire via the communication opening and the wire connection opening. The battery module is connected to the motherboard by a power wire via the wire connection opening.
    Type: Application
    Filed: June 2, 2020
    Publication date: December 2, 2021
    Inventor: HSI-YANG YEH
  • Patent number: 9930795
    Abstract: An electronic device having a removable handle is provided and includes a handle, two connecting elements, and a body. The handle is coupled to the body through the connecting elements to allow a user to change the handle through the connecting elements as needed, thereby rendering the use of the handle highly flexible. Bumps of the connecting elements are disposed at concave portions on the body, respectively. The fastening components fasten the connecting elements to the body. Therefore, the connecting elements are firmly coupled to the body to enhance overall structural stability after assembly and usage safety of using the handle to carry the body.
    Type: Grant
    Filed: August 9, 2016
    Date of Patent: March 27, 2018
    Assignee: GETAC TECHNOLOGY CORPORATION
    Inventors: Chia-Wei Chang, Hsi-Yang Yeh
  • Publication number: 20180049332
    Abstract: An electronic device having a removable handle is provided and includes a handle, two connecting elements, and a body. The handle is coupled to the body through the connecting elements to allow a user to change the handle through the connecting elements as needed, thereby rendering the use of the handle highly flexible. Bumps of the connecting elements are disposed at concave portions on the body, respectively. The fastening components fasten the connecting elements to the body. Therefore, the connecting elements are firmly coupled to the body to enhance overall structural stability after assembly and usage safety of using the handle to carry the body.
    Type: Application
    Filed: August 9, 2016
    Publication date: February 15, 2018
    Inventors: Chia-Wei CHANG, Hsi-Yang Yeh